揭开二维碳基导电胶的神秘面纱:结构与性能对比分析

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Naghmeh Gholamalizadeh, Sajjad Mirfaeghi, Farhad Sharif, Saeedeh Mazinani, Ali Mohammad Bazargan
{"title":"揭开二维碳基导电胶的神秘面纱:结构与性能对比分析","authors":"Naghmeh Gholamalizadeh,&nbsp;Sajjad Mirfaeghi,&nbsp;Farhad Sharif,&nbsp;Saeedeh Mazinani,&nbsp;Ali Mohammad Bazargan","doi":"10.1007/s10854-024-13775-y","DOIUrl":null,"url":null,"abstract":"<div><p>The rise in popularity of carbon-based adhesives is revolutionizing the industry, offering eco-friendly alternatives that can be recycled while protecting the environment from the harmful effects of solder metal. In this ground breaking study, we delve into the impact of different carbon-based conductive fillers on the overall performance of the adhesive. From reduced graphene oxide (rGO) to thermally and chemically expanded graphite (EG), we explore these fillers’ intricate 3D network structure and how they enhance both the final product’s electrical conductivity and mechanical strength. According to the findings of this research, the structure of 3D and interwoven EG plays the prominent role in electrical conductivity. Maintaining the 3D and stable structure after making the composite is due to the structure of EG, which prevents the graphene sheets from falling on top of each other, preventing the interaction of free electrons with vertical sheets. On the other hand, a similar structure was obtained using two separate methods of thermal and chemical expansion, which is optimal in terms of electrical conductivity. Our findings reveal that an adhesive containing 17.5 wt% of EG achieved a volume resistivity of 2.5 Ω cm, showcasing the remarkable conductivity of these materials. The unique 3D network structure improves electrical performance and aids in the curing process by reducing curing enthalpy to 147.19 J g<sup>−1</sup>, resulting in superior mechanical properties and adhesion. Furthermore, by studying the effects of functional groups and surface characteristics of chemically expanded graphite (CEG), we discovered that sharp edges and wrinkled sheets significantly enhance the adhesive’s tensile strength, surpassing 10.24 ± 1.2 MPa. The Young’s modulus of 96.24 ± 6 MPa represents moderate stiffness while also allowing for flexibility. The results show carbon-based adhesives’ potential and pave the way for a more sustainable product.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"35 32","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2024-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Unveiling the power of 2D carbon-based electrically conductive adhesive: a comparative analysis on structure and performance\",\"authors\":\"Naghmeh Gholamalizadeh,&nbsp;Sajjad Mirfaeghi,&nbsp;Farhad Sharif,&nbsp;Saeedeh Mazinani,&nbsp;Ali Mohammad Bazargan\",\"doi\":\"10.1007/s10854-024-13775-y\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The rise in popularity of carbon-based adhesives is revolutionizing the industry, offering eco-friendly alternatives that can be recycled while protecting the environment from the harmful effects of solder metal. In this ground breaking study, we delve into the impact of different carbon-based conductive fillers on the overall performance of the adhesive. From reduced graphene oxide (rGO) to thermally and chemically expanded graphite (EG), we explore these fillers’ intricate 3D network structure and how they enhance both the final product’s electrical conductivity and mechanical strength. According to the findings of this research, the structure of 3D and interwoven EG plays the prominent role in electrical conductivity. Maintaining the 3D and stable structure after making the composite is due to the structure of EG, which prevents the graphene sheets from falling on top of each other, preventing the interaction of free electrons with vertical sheets. On the other hand, a similar structure was obtained using two separate methods of thermal and chemical expansion, which is optimal in terms of electrical conductivity. Our findings reveal that an adhesive containing 17.5 wt% of EG achieved a volume resistivity of 2.5 Ω cm, showcasing the remarkable conductivity of these materials. The unique 3D network structure improves electrical performance and aids in the curing process by reducing curing enthalpy to 147.19 J g<sup>−1</sup>, resulting in superior mechanical properties and adhesion. Furthermore, by studying the effects of functional groups and surface characteristics of chemically expanded graphite (CEG), we discovered that sharp edges and wrinkled sheets significantly enhance the adhesive’s tensile strength, surpassing 10.24 ± 1.2 MPa. The Young’s modulus of 96.24 ± 6 MPa represents moderate stiffness while also allowing for flexibility. The results show carbon-based adhesives’ potential and pave the way for a more sustainable product.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"35 32\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-11-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-024-13775-y\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-024-13775-y","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

碳基粘合剂的兴起正在掀起一场行业革命,它提供了可回收利用的环保型替代品,同时保护环境免受金属焊料的有害影响。在这项突破性研究中,我们深入探讨了不同碳基导电填料对粘合剂整体性能的影响。从还原氧化石墨烯(rGO)到热膨胀和化学膨胀石墨(EG),我们探索了这些填料错综复杂的三维网络结构,以及它们如何增强最终产品的导电性和机械强度。研究结果表明,三维交织的 EG 结构在导电性方面发挥着重要作用。制作复合材料后,之所以能保持三维和稳定的结构,是因为 EG 的结构能防止石墨烯薄片相互叠落,从而阻止自由电子与垂直薄片的相互作用。另一方面,使用热膨胀和化学膨胀两种不同的方法也能获得类似的结构,这在导电性方面是最佳的。我们的研究结果表明,含有 17.5 wt% EG 的粘合剂的体积电阻率达到了 2.5 Ω cm,展示了这些材料的卓越导电性。独特的三维网络结构提高了电气性能,并通过将固化焓降低到 147.19 J g-1 来帮助固化过程,从而实现了优异的机械性能和粘附性。此外,通过研究官能团和化学膨胀石墨(CEG)表面特性的影响,我们发现尖锐边缘和起皱的薄片能显著提高粘合剂的抗拉强度,超过 10.24 ± 1.2 兆帕。杨氏模量为 96.24 ± 6 兆帕,刚度适中,同时也有一定的柔韧性。这些结果表明了碳基粘合剂的潜力,并为生产更具可持续性的产品铺平了道路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Unveiling the power of 2D carbon-based electrically conductive adhesive: a comparative analysis on structure and performance

The rise in popularity of carbon-based adhesives is revolutionizing the industry, offering eco-friendly alternatives that can be recycled while protecting the environment from the harmful effects of solder metal. In this ground breaking study, we delve into the impact of different carbon-based conductive fillers on the overall performance of the adhesive. From reduced graphene oxide (rGO) to thermally and chemically expanded graphite (EG), we explore these fillers’ intricate 3D network structure and how they enhance both the final product’s electrical conductivity and mechanical strength. According to the findings of this research, the structure of 3D and interwoven EG plays the prominent role in electrical conductivity. Maintaining the 3D and stable structure after making the composite is due to the structure of EG, which prevents the graphene sheets from falling on top of each other, preventing the interaction of free electrons with vertical sheets. On the other hand, a similar structure was obtained using two separate methods of thermal and chemical expansion, which is optimal in terms of electrical conductivity. Our findings reveal that an adhesive containing 17.5 wt% of EG achieved a volume resistivity of 2.5 Ω cm, showcasing the remarkable conductivity of these materials. The unique 3D network structure improves electrical performance and aids in the curing process by reducing curing enthalpy to 147.19 J g−1, resulting in superior mechanical properties and adhesion. Furthermore, by studying the effects of functional groups and surface characteristics of chemically expanded graphite (CEG), we discovered that sharp edges and wrinkled sheets significantly enhance the adhesive’s tensile strength, surpassing 10.24 ± 1.2 MPa. The Young’s modulus of 96.24 ± 6 MPa represents moderate stiffness while also allowing for flexibility. The results show carbon-based adhesives’ potential and pave the way for a more sustainable product.

求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信