{"title":"超高 K 单元电池厚 α-CaCr2O4 晶体","authors":"Hui Li, Chuan Xu, Zhibo Liu, Tianya Zhou, Jinmeng Tong, Qiang Wang, Xuanya Liu, Qianqian Jin, Hui-Ming Cheng and Wencai Ren*, ","doi":"10.1021/acsnano.4c0703210.1021/acsnano.4c07032","DOIUrl":null,"url":null,"abstract":"<p >High-dielectric-constant (high-<i>k</i>) insulators are indispensable components to integrate semiconductors into metal-oxide-semiconductor field-effect transistors with sub-10 nm channel length, where the equivalent oxide thickness (EOT) of high-<i>k</i> insulator needs to be decreased to subnanometer scale. The traditional insulators, including Al<sub>2</sub>O<sub>3</sub>, SiO<sub>2</sub>, and HfO<sub>2</sub>, fit well with the existing silicon industry but suffer from serious degeneration of insulating properties, such as large leakage currents caused by high-density borders and interface traps, when their thicknesses are reduced to a few nanometers. Here, we synthesize a high-quality nonlayered ultrathin α-CaCr<sub>2</sub>O<sub>4</sub> crystal down to unit-cell thickness (∼1.2 nm) by an elements slow-supply chemical vapor deposition (CVD) method. The unit-cell-thick α-CaCr<sub>2</sub>O<sub>4</sub> crystals show a super high dielectric constant of 87.34, which is over 20 times higher than that of well-known layered insulator <i>h</i>-BN and corresponds to an EOT below 1 nm. Furthermore, it has a high breaking strength (39 GPa) and excellent stability. This strategy can also be used to fabricate other ultrathin ternary oxides, such as high-<i>k</i> ultrathin FeNb<sub>2</sub>O<sub>6</sub> crystals, demonstrating the universality of the CVD method.</p>","PeriodicalId":21,"journal":{"name":"ACS Nano","volume":"18 45","pages":"31014–31020 31014–31020"},"PeriodicalIF":15.8000,"publicationDate":"2024-10-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Super High-k Unit-Cell-Thick α-CaCr2O4 Crystals\",\"authors\":\"Hui Li, Chuan Xu, Zhibo Liu, Tianya Zhou, Jinmeng Tong, Qiang Wang, Xuanya Liu, Qianqian Jin, Hui-Ming Cheng and Wencai Ren*, \",\"doi\":\"10.1021/acsnano.4c0703210.1021/acsnano.4c07032\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p >High-dielectric-constant (high-<i>k</i>) insulators are indispensable components to integrate semiconductors into metal-oxide-semiconductor field-effect transistors with sub-10 nm channel length, where the equivalent oxide thickness (EOT) of high-<i>k</i> insulator needs to be decreased to subnanometer scale. The traditional insulators, including Al<sub>2</sub>O<sub>3</sub>, SiO<sub>2</sub>, and HfO<sub>2</sub>, fit well with the existing silicon industry but suffer from serious degeneration of insulating properties, such as large leakage currents caused by high-density borders and interface traps, when their thicknesses are reduced to a few nanometers. Here, we synthesize a high-quality nonlayered ultrathin α-CaCr<sub>2</sub>O<sub>4</sub> crystal down to unit-cell thickness (∼1.2 nm) by an elements slow-supply chemical vapor deposition (CVD) method. The unit-cell-thick α-CaCr<sub>2</sub>O<sub>4</sub> crystals show a super high dielectric constant of 87.34, which is over 20 times higher than that of well-known layered insulator <i>h</i>-BN and corresponds to an EOT below 1 nm. Furthermore, it has a high breaking strength (39 GPa) and excellent stability. This strategy can also be used to fabricate other ultrathin ternary oxides, such as high-<i>k</i> ultrathin FeNb<sub>2</sub>O<sub>6</sub> crystals, demonstrating the universality of the CVD method.</p>\",\"PeriodicalId\":21,\"journal\":{\"name\":\"ACS Nano\",\"volume\":\"18 45\",\"pages\":\"31014–31020 31014–31020\"},\"PeriodicalIF\":15.8000,\"publicationDate\":\"2024-10-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Nano\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://pubs.acs.org/doi/10.1021/acsnano.4c07032\",\"RegionNum\":1,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"CHEMISTRY, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Nano","FirstCategoryId":"88","ListUrlMain":"https://pubs.acs.org/doi/10.1021/acsnano.4c07032","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
High-dielectric-constant (high-k) insulators are indispensable components to integrate semiconductors into metal-oxide-semiconductor field-effect transistors with sub-10 nm channel length, where the equivalent oxide thickness (EOT) of high-k insulator needs to be decreased to subnanometer scale. The traditional insulators, including Al2O3, SiO2, and HfO2, fit well with the existing silicon industry but suffer from serious degeneration of insulating properties, such as large leakage currents caused by high-density borders and interface traps, when their thicknesses are reduced to a few nanometers. Here, we synthesize a high-quality nonlayered ultrathin α-CaCr2O4 crystal down to unit-cell thickness (∼1.2 nm) by an elements slow-supply chemical vapor deposition (CVD) method. The unit-cell-thick α-CaCr2O4 crystals show a super high dielectric constant of 87.34, which is over 20 times higher than that of well-known layered insulator h-BN and corresponds to an EOT below 1 nm. Furthermore, it has a high breaking strength (39 GPa) and excellent stability. This strategy can also be used to fabricate other ultrathin ternary oxides, such as high-k ultrathin FeNb2O6 crystals, demonstrating the universality of the CVD method.
期刊介绍:
ACS Nano, published monthly, serves as an international forum for comprehensive articles on nanoscience and nanotechnology research at the intersections of chemistry, biology, materials science, physics, and engineering. The journal fosters communication among scientists in these communities, facilitating collaboration, new research opportunities, and advancements through discoveries. ACS Nano covers synthesis, assembly, characterization, theory, and simulation of nanostructures, nanobiotechnology, nanofabrication, methods and tools for nanoscience and nanotechnology, and self- and directed-assembly. Alongside original research articles, it offers thorough reviews, perspectives on cutting-edge research, and discussions envisioning the future of nanoscience and nanotechnology.