MANTIS:混合信号近传感器卷积成像仪 SoC,使用电荷域 4b 加权 5 至 84-TOPS/W MAC 运算进行特征提取和兴趣区域检测

IF 4.6 1区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Martin Lefebvre;David Bol
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摘要

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MANTIS: A Mixed-Signal Near-Sensor Convolutional Imager SoC Using Charge-Domain 4b-Weighted 5-to-84-TOPS/W MAC Operations for Feature Extraction and Region-of-Interest Detection
Recent advances in artificial intelligence (AI) have prompted the search for enhanced algorithms and hardware to support the deployment of machine learning (ML) at the edge. More specifically, in the context of the Internet of Things (IoT), vision chips must be able to fulfill the tasks of low to medium complexity, such as feature extraction (FE) or region-of-interest (RoI) detection, with a sub-mW power budget imposed by the use of small batteries or energy harvesting. Mixed-signal vision chips relying on in- or near-sensor processing have emerged as an interesting candidate because of their favorable tradeoff between energy efficiency (EE) and computational accuracy compared with digital systems for these specific tasks. In this article, we introduce a mixed-signal convolutional imager system-on-chip (SoC) codenamed MANTIS, featuring a unique combination of large $16{\times }16~4$ b-weighted filters, operation at multiple scales, and double sampling, well suited to the requirements of medium-complexity tasks. The main contributions are (i) circuits called DS3 units combining delta-reset sampling (DRS), image downsampling (DS), and voltage downshifting and (ii) charge-domain multiply-and-accumulate (MAC) operations based on switched-capacitor (SC) amplifiers and charge sharing in the capacitive DAC of the successive-approximation (SAR) ADCs, MANTIS achieves peak EEs normalized to 1b operations of 4.6 and 84.1 TOPS/W at the accelerator and SoC levels, while computing feature maps (fmaps) with a root-mean-square error (RMSE) ranging from 3 to 11.3%. It also demonstrates a face RoI detection with a false negative rate (FNR) of 11.5%, while discarding 81.3% of image patches and reducing the data transmitted off chip by $13{\times }$ compared with the raw image.
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来源期刊
IEEE Journal of Solid-state Circuits
IEEE Journal of Solid-state Circuits 工程技术-工程:电子与电气
CiteScore
11.00
自引率
20.40%
发文量
351
审稿时长
3-6 weeks
期刊介绍: The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.
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