使用铜和铬靶材反应溅射沉积 CuCrO2 薄膜的表征

IF 5.2 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Akash Hari Bharath and Kalpathy B. Sundaram
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引用次数: 0

摘要

本研究采用双溅射技术成功合成了单相delafossite CuCrO2薄膜。铜靶采用直流源,而铬靶则采用射频源,以氧气作为反应气体进行溅射。薄膜在 400 °C 的温度下在石英基底上溅射。铬的溅射功率保持在 100 W,而铜的溅射功率则在 10 W 到 40 W 之间。XRD 检查证实,在铜靶功率为 20 W 时,实现了单相 CuCrO2。铜 :Cr at% 成分比为 1 :1 :SEM 晶粒大小在 100 nm 到 150 nm 之间,光学研究表明其透光率为 57.5%,带隙为 3.08 eV。单相薄膜的电阻率为 28.6 Ω 厘米。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Characterization of reactively sputter deposited CuCrO2 thin films using Cu and Cr targets

Characterization of reactively sputter deposited CuCrO2 thin films using Cu and Cr targets

In this research, single phase delafossite CuCrO2 thin films were successfully synthesized using dual sputtering technique. A DC source was employed for the copper target, whereas the chromium target was sputtered using an RF source with oxygen acting as the reactive gas. The films were sputtered on a quartz substrate at 400 °C. The sputtering power for chromium was maintained at 100 W, while the power for copper ranged from 10 W to 40 W. Following deposition, the films were annealed in a nitrogen environment for 10 hours at 800 °C. XRD examination confirmed that single-phase CuCrO2 was achieved with a copper target power of 20 W. The findings of the XRD investigation were further validated by XPS analysis. Cu : Cr at% composition ratio of 1 : 1 : 04 was obtained when deposited at a power of 20 W. SEM grain sizes ranged from 100 nm to 150 nm optical studies indicated an optical transmission of 57.5% and a bandgap of 3.08 eV. The single-phase film demonstrated a resistivity of 28.6 Ω cm.

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来源期刊
Materials Advances
Materials Advances MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
7.60
自引率
2.00%
发文量
665
审稿时长
5 weeks
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