利用 3-D HBM 在集群 Manycores 上实现基于 ML 的散热和缓存争用缓解

IF 2.7 3区 计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Mohammed Bakr Sikal;Heba Khdr;Lokesh Siddhu;Jörg Henkel
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引用次数: 0

摘要

在 2.5D/3-D 集成和封装技术不断进步的推动下,集群多核处理器与高带宽内存(HBM)的集成日益突出,以满足日益增长的内存带宽需求。虽然这种集成能带来显著的性能提升,但仍受限于集群末级高速缓存的高速缓存争用和三维 HBM 的热问题。虽然现有的最先进的资源管理技术已经单独解决了这些问题,但我们认为必须联合考虑多核和 HBM 的缓存争用和温度问题,才能充分发挥这种现代架构的性能潜力。为了弥补文献中的这一空白,我们提出了 MTCM,这是第一种在最大化系统性能时考虑缓存争用的资源管理技术,同时还能保持多核和 HBM 堆栈的热安全性。在我们精确而轻量级的神经网络模型的支持下,我们提出的任务迁移以及动态电压和频率扩展策略可以准确预测运行时决策对两个子系统的性能和温度的影响。我们广泛的评估实验表明,在保持多核和 HBM 热安全性的同时,性能比现有技术水平显著提高了 1 美元/次。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
ML-Based Thermal and Cache Contention Alleviation on Clustered Manycores With 3-D HBM
Enabled by the recent advancements in 2.5D/3-D integration and packaging, the integration of clustered manycore processors with high-bandwidth memory (HBM) is gaining prominence to satisfy the increasing memory bandwidth demands. Although this integration can offer significant performance gains, it is still limited by cache contention in the final-level cache on the clusters and by the thermal issues in the 3-D HBM. While the existing state-of-the-art resource management techniques have tackled these issues in isolation, we argue that the cache contention and the temperature of both the manycore and the HBM must be considered jointly to harness the full performance potential of such modern architectures. To cover this gap in the literature, we present MTCM, the first resource management technique that considers the cache contention in maximizing the system performance, while maintaining the thermal safety across both the manycore and the HBM stack. Enabled by our accurate, yet lightweight, neural network models, our proposed task migration and dynamic voltage and frequency scaling policies can accurately predict the impact of runtime decisions on the performance and temperature of both the subsystems. Our extensive evaluation experiments reveal a significant performance improvement over existing state of the art by up to $1\times $ , while maintaining thermal safety of both the manycore and the HBM.
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来源期刊
CiteScore
5.60
自引率
13.80%
发文量
500
审稿时长
7 months
期刊介绍: The purpose of this Transactions is to publish papers of interest to individuals in the area of computer-aided design of integrated circuits and systems composed of analog, digital, mixed-signal, optical, or microwave components. The aids include methods, models, algorithms, and man-machine interfaces for system-level, physical and logical design including: planning, synthesis, partitioning, modeling, simulation, layout, verification, testing, hardware-software co-design and documentation of integrated circuit and system designs of all complexities. Design tools and techniques for evaluating and designing integrated circuits and systems for metrics such as performance, power, reliability, testability, and security are a focus.
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