{"title":"论 PVD 工艺中不同气体比例下超薄氮化钛薄膜的力学性能","authors":"Yao-Zih Lai , Weileun Fang","doi":"10.1016/j.mee.2024.112283","DOIUrl":null,"url":null,"abstract":"<div><div>Titanium Nitride (TiN<sub>x</sub>) thin film has numerous applications in semiconductors, nanotechnology, and various aspects of daily life. This study presents an approach to adjusting the mechanical properties of TiN<sub>x</sub> ultrathin films, including Young's modulus, residual stress, and coefficients of thermal expansion (CTE), by varying the gas ratio of N<sub>2</sub> and Ar during the Physical Vapor Deposition (PVD) process (DC magnetron sputtering). In the experiment, TiN<sub>x</sub> films with three different gas ratios R<sub>N</sub> (= N<sub>2</sub>/(N<sub>2</sub> + Ar)) were investigated. To demonstrate the feasibility of this approach, TiN<sub>x</sub> films with different R<sub>N</sub> values (0.3, 0.5, and 0.8) were deposited on SiO<sub>2</sub> beams to form composite test cantilevers. Measurements reveal significant changes (ranging from 33 % to 2-fold) in Young's modulus, residual stress, and CTE of the TiN<sub>x</sub> films by varying the gas ratio during the PVD process. As a result, this study provides a straightforward approach and guidelines for users to tailor TiN<sub>x</sub> films according to specific application requirements.</div></div>","PeriodicalId":18557,"journal":{"name":"Microelectronic Engineering","volume":null,"pages":null},"PeriodicalIF":2.6000,"publicationDate":"2024-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"On the mechanical properties of ultrathin titanium nitride films under different gas ratios of PVD process\",\"authors\":\"Yao-Zih Lai , Weileun Fang\",\"doi\":\"10.1016/j.mee.2024.112283\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Titanium Nitride (TiN<sub>x</sub>) thin film has numerous applications in semiconductors, nanotechnology, and various aspects of daily life. This study presents an approach to adjusting the mechanical properties of TiN<sub>x</sub> ultrathin films, including Young's modulus, residual stress, and coefficients of thermal expansion (CTE), by varying the gas ratio of N<sub>2</sub> and Ar during the Physical Vapor Deposition (PVD) process (DC magnetron sputtering). In the experiment, TiN<sub>x</sub> films with three different gas ratios R<sub>N</sub> (= N<sub>2</sub>/(N<sub>2</sub> + Ar)) were investigated. To demonstrate the feasibility of this approach, TiN<sub>x</sub> films with different R<sub>N</sub> values (0.3, 0.5, and 0.8) were deposited on SiO<sub>2</sub> beams to form composite test cantilevers. Measurements reveal significant changes (ranging from 33 % to 2-fold) in Young's modulus, residual stress, and CTE of the TiN<sub>x</sub> films by varying the gas ratio during the PVD process. As a result, this study provides a straightforward approach and guidelines for users to tailor TiN<sub>x</sub> films according to specific application requirements.</div></div>\",\"PeriodicalId\":18557,\"journal\":{\"name\":\"Microelectronic Engineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.6000,\"publicationDate\":\"2024-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronic Engineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0167931724001527\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronic Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167931724001527","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
On the mechanical properties of ultrathin titanium nitride films under different gas ratios of PVD process
Titanium Nitride (TiNx) thin film has numerous applications in semiconductors, nanotechnology, and various aspects of daily life. This study presents an approach to adjusting the mechanical properties of TiNx ultrathin films, including Young's modulus, residual stress, and coefficients of thermal expansion (CTE), by varying the gas ratio of N2 and Ar during the Physical Vapor Deposition (PVD) process (DC magnetron sputtering). In the experiment, TiNx films with three different gas ratios RN (= N2/(N2 + Ar)) were investigated. To demonstrate the feasibility of this approach, TiNx films with different RN values (0.3, 0.5, and 0.8) were deposited on SiO2 beams to form composite test cantilevers. Measurements reveal significant changes (ranging from 33 % to 2-fold) in Young's modulus, residual stress, and CTE of the TiNx films by varying the gas ratio during the PVD process. As a result, this study provides a straightforward approach and guidelines for users to tailor TiNx films according to specific application requirements.
期刊介绍:
Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.