Synergy between biphenyl mesomorphic structure and organic crystal phenazine for improving the intrinsic thermal conductivity of epoxy

The inherent low intrinsic thermal conductivity of epoxy resin severely restricts its potential application, making it difficult to meet the growing demand of energy, electrical and electronic technologies. The liquid crystal epoxy resin, which is wildly employed to improve the intrinsic thermal conductivity of epoxy resin, is constrained by its complex molecular structure design and synthesis procedures. In this work, the rigid group of 4,4′-dihydroxybiphenyl was introduced into the main chain of epoxy resin by ring-opening polymerization (ROP) to change the molecular structure of epoxy resin. The introduction of biphenyl groups enhances the orderliness of molecular structure and forms hydrogen bonds between molecules, which further enhances the transport of intramolecular phonons. The thermal conductivity of the graft modified epoxy resin (GMR) after DDM curing is 0.30 W m⁻¹ K⁻¹. After adding of organic crystal phenazine (PNE) to the GMR matrix, the inherent strong crystallization behaviors of PNE can accelerate the regularity arrangement of rigid groups in GMR, and promote the nucleation and crystallization process of GMR/PNE. The thermal conductivity of GMR/PNE after DDM curing can reach 0.33 W m⁻¹ K⁻¹. It is 165 % of the thermal conductivity of traditional epoxy resin, which is 0.2 W m⁻¹ K⁻¹. This study will provide a new method to improve the intrinsic thermal conductivity of polymer materials.