{"title":"通过自蔓延高温合成（SHS）制备铝/氮化铝基导热膏填料","authors":"Anton Reger, Alexander Akulinkin","doi":"10.1007/s10854-024-13703-0","DOIUrl":null,"url":null,"abstract":"<div><p>This paper describes the synthesis of material with different aluminum and aluminum nitride concentrations through the nitriding combustion of aluminum. The effect of pre-nitrided additives on combustion rate, maximum combustion temperature, and nitrogen and oxygen content in the synthesized products is analyzed. Additionally, the phase composition and microstructure of the synthesized materials are presented. The synthesized material is used as filler for thermal paste with an organosilicon binder (polymethylsiloxane). The thermal paste with filler, produced by one-step combustion of aluminum with the highest amount of unreacted aluminum, exhibited the highest thermal conductivity coefficient. With increasing the aluminum concentration, the thermal paste maintained its dielectric properties. The thermal paste demonstrated high efficiency in dissipating heat when applied between the heatsink and the heated body. The CPU stress test confirmed its effectiveness.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"35 31","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2024-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Al/AlN-based thermal paste fillers prepared by self-propagating high-temperature synthesis (SHS)\",\"authors\":\"Anton Reger, Alexander Akulinkin\",\"doi\":\"10.1007/s10854-024-13703-0\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>This paper describes the synthesis of material with different aluminum and aluminum nitride concentrations through the nitriding combustion of aluminum. The effect of pre-nitrided additives on combustion rate, maximum combustion temperature, and nitrogen and oxygen content in the synthesized products is analyzed. Additionally, the phase composition and microstructure of the synthesized materials are presented. The synthesized material is used as filler for thermal paste with an organosilicon binder (polymethylsiloxane). The thermal paste with filler, produced by one-step combustion of aluminum with the highest amount of unreacted aluminum, exhibited the highest thermal conductivity coefficient. With increasing the aluminum concentration, the thermal paste maintained its dielectric properties. The thermal paste demonstrated high efficiency in dissipating heat when applied between the heatsink and the heated body. The CPU stress test confirmed its effectiveness.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"35 31\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-11-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-024-13703-0\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-024-13703-0","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Al/AlN-based thermal paste fillers prepared by self-propagating high-temperature synthesis (SHS)
This paper describes the synthesis of material with different aluminum and aluminum nitride concentrations through the nitriding combustion of aluminum. The effect of pre-nitrided additives on combustion rate, maximum combustion temperature, and nitrogen and oxygen content in the synthesized products is analyzed. Additionally, the phase composition and microstructure of the synthesized materials are presented. The synthesized material is used as filler for thermal paste with an organosilicon binder (polymethylsiloxane). The thermal paste with filler, produced by one-step combustion of aluminum with the highest amount of unreacted aluminum, exhibited the highest thermal conductivity coefficient. With increasing the aluminum concentration, the thermal paste maintained its dielectric properties. The thermal paste demonstrated high efficiency in dissipating heat when applied between the heatsink and the heated body. The CPU stress test confirmed its effectiveness.
期刊介绍：
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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