{"title":"通过动态偏转激光束修整晶片倒角砂轮","authors":"","doi":"10.1016/j.optlaseng.2024.108673","DOIUrl":null,"url":null,"abstract":"<div><div>Wafer chamfering forming grinding wheels (WCF) is a kind of V-shaped circular groove forming wheel with a large diameter and small grooves. In this study, a dynamic deflection laser beam method is presented to improve the dressing quality of WCF. The compensation effect of deflected laser on the surface laser energy density of materials was analyzed, and the blocking effect caused by oversized deflection angle of laser beam was analyzed. A C-W model was proposed for laser dressing of WCF. Based on C-W model, trajectory planning for laser dressing was carried out, and dressing experiments were completed. The results show that the contour transition of the grinding wheel is more smooth. Compared to single direct laser beam dressing method and static deflection laser dressing method, the contour exhibits better roundness and the PV values reduced to 5.1μm. Surface observation revealed strip-shaped patterns and some flocculent metamorphic layer. The SEM result shows that there are no obvious crack defects on the surface.</div></div>","PeriodicalId":49719,"journal":{"name":"Optics and Lasers in Engineering","volume":null,"pages":null},"PeriodicalIF":3.5000,"publicationDate":"2024-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Wafer chamfering grinding wheels dressing via dynamic deflection laser beam\",\"authors\":\"\",\"doi\":\"10.1016/j.optlaseng.2024.108673\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Wafer chamfering forming grinding wheels (WCF) is a kind of V-shaped circular groove forming wheel with a large diameter and small grooves. In this study, a dynamic deflection laser beam method is presented to improve the dressing quality of WCF. The compensation effect of deflected laser on the surface laser energy density of materials was analyzed, and the blocking effect caused by oversized deflection angle of laser beam was analyzed. A C-W model was proposed for laser dressing of WCF. Based on C-W model, trajectory planning for laser dressing was carried out, and dressing experiments were completed. The results show that the contour transition of the grinding wheel is more smooth. Compared to single direct laser beam dressing method and static deflection laser dressing method, the contour exhibits better roundness and the PV values reduced to 5.1μm. Surface observation revealed strip-shaped patterns and some flocculent metamorphic layer. The SEM result shows that there are no obvious crack defects on the surface.</div></div>\",\"PeriodicalId\":49719,\"journal\":{\"name\":\"Optics and Lasers in Engineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":3.5000,\"publicationDate\":\"2024-11-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Optics and Lasers in Engineering\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0143816624006511\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"OPTICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optics and Lasers in Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0143816624006511","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"OPTICS","Score":null,"Total":0}
Wafer chamfering grinding wheels dressing via dynamic deflection laser beam
Wafer chamfering forming grinding wheels (WCF) is a kind of V-shaped circular groove forming wheel with a large diameter and small grooves. In this study, a dynamic deflection laser beam method is presented to improve the dressing quality of WCF. The compensation effect of deflected laser on the surface laser energy density of materials was analyzed, and the blocking effect caused by oversized deflection angle of laser beam was analyzed. A C-W model was proposed for laser dressing of WCF. Based on C-W model, trajectory planning for laser dressing was carried out, and dressing experiments were completed. The results show that the contour transition of the grinding wheel is more smooth. Compared to single direct laser beam dressing method and static deflection laser dressing method, the contour exhibits better roundness and the PV values reduced to 5.1μm. Surface observation revealed strip-shaped patterns and some flocculent metamorphic layer. The SEM result shows that there are no obvious crack defects on the surface.
期刊介绍:
Optics and Lasers in Engineering aims at providing an international forum for the interchange of information on the development of optical techniques and laser technology in engineering. Emphasis is placed on contributions targeted at the practical use of methods and devices, the development and enhancement of solutions and new theoretical concepts for experimental methods.
Optics and Lasers in Engineering reflects the main areas in which optical methods are being used and developed for an engineering environment. Manuscripts should offer clear evidence of novelty and significance. Papers focusing on parameter optimization or computational issues are not suitable. Similarly, papers focussed on an application rather than the optical method fall outside the journal''s scope. The scope of the journal is defined to include the following:
-Optical Metrology-
Optical Methods for 3D visualization and virtual engineering-
Optical Techniques for Microsystems-
Imaging, Microscopy and Adaptive Optics-
Computational Imaging-
Laser methods in manufacturing-
Integrated optical and photonic sensors-
Optics and Photonics in Life Science-
Hyperspectral and spectroscopic methods-
Infrared and Terahertz techniques