在空气中将无氧化银多孔板粘合到裸铜基板上

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2024-10-29 DOI:10.1016/j.matlet.2024.137633

Eunjin Jo , YehRi Kim , Sangmin Lee , Masahiko Nishijima , Chuantong Chen , Katsuaki Suganuma , Young-Bae Park , Dongjin Kim

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引用次数: 0

摘要

在这项研究中，通过开发一种均压和氧化抑制键合工艺，实现了在空气环境中在裸铜基底上烧结无氧化银片。在 250 °C 和 280 °C 的空气环境中，使用阻氧压力键合系统将裸铜基板和镀银模具与纳米级多孔银片键合。无氧纳米多孔银片在空气中的粘接强度超过 39 兆帕，随着温度的升高，粘接率可提高 30%，具体取决于缩颈长度和连接方式。透射电子显微镜（TEM）分析进一步研究了银烧结层的微观结构。

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Oxidation-free silver porous sheet bonding onto a bare copper substrate in air

In this study, the sintering of Ag sheets on bare Cu substrate in an air atmosphere without oxidation was achieved by developing a uniform pressure and oxidation inhibition bonding process. Bare Cu substrates and Ag plated dies were bonded with a nano scaled porous Ag sheet at 250 °C and 280 °C in an air atmosphere using an oxygen-blocking pressure bonding system. Oxygen-free Ag nanoporous sheet bonding achieved over 39 MPa strength in air, with up to 30 % bonding ratio increase as temperature rose, depending on necking length and connection. The microstructure of the Ag sintered layer was further investigated by transmission electron microscopy (TEM) analysis.

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive