Christian Gaida, Tobias Heuermann, Sven Breitkopf, Tino Eidam, Jens Limpert
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Industrial-grade 2-μm ultrafast fiber laser CPA for silicon processing
A novel compact laser utilizing thulium-based fiber chirped-pulse amplification (CPA) technology has been developed to enable essential tasks such as microwelding or the precision cutting of filaments with semiconductors such as silicon. At a central wavelength of 2 μm, the activeTwo-15 provides pulse energies exceeding 100 μJ and an average power output surpassing 15 W, and can be seamlessly integrated into systems for materials processing.
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