{"title":"设计和制造用于压阻压力传感器的超薄硅基应变片","authors":"Jun-Hwan Choi, Jung-Sik Kim","doi":"10.1016/j.cap.2024.10.015","DOIUrl":null,"url":null,"abstract":"<div><div>Ultra-thin (20 μm) silicon strain gauges were fabricated with silicon-on-insulator (SOI) wafer <strong>by a newly-conceived wet etching process. Buffered oxide etchant (BOE, NH</strong><sub><strong>4</strong></sub><strong>F: HF = 6:1) solution with additives of octylamine and octanol was used for wet etching process in which the operating temperature was 50°C.</strong> Photoresist as a passivation layer was deposited on the upper side of SOI wafer to minimize strain gauge damage by chemical etchants. Small amount of octylamine and octanol were added to BOE solution to improve surface wettability and SiO<sub>2</sub>/Si selectivity. The fabricated strain gauges were attached to the pressure diaphragm and the performance of strain gauge was investigated by measuring with the hydraulic pressure system. The resistance changed linearly with tensile and compressive strains. <strong>Maximum values of non-linearity, hysteresis, thermal coefficient of resistance (TCR) and sensitivity were -0.341 %, 0.909 %, 4128 ppm/°C and 34.22 mV/V respectively. The fabricated strain gauges might be well applicable to the hydrogen pressure sensor which is detectable for high pressure range (0–900 bar).</strong></div></div>","PeriodicalId":11037,"journal":{"name":"Current Applied Physics","volume":"69 ","pages":"Pages 28-35"},"PeriodicalIF":2.4000,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design and fabrication of ultrathin silicon-based strain gauges for piezoresistive pressure sensor\",\"authors\":\"Jun-Hwan Choi, Jung-Sik Kim\",\"doi\":\"10.1016/j.cap.2024.10.015\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Ultra-thin (20 μm) silicon strain gauges were fabricated with silicon-on-insulator (SOI) wafer <strong>by a newly-conceived wet etching process. Buffered oxide etchant (BOE, NH</strong><sub><strong>4</strong></sub><strong>F: HF = 6:1) solution with additives of octylamine and octanol was used for wet etching process in which the operating temperature was 50°C.</strong> Photoresist as a passivation layer was deposited on the upper side of SOI wafer to minimize strain gauge damage by chemical etchants. Small amount of octylamine and octanol were added to BOE solution to improve surface wettability and SiO<sub>2</sub>/Si selectivity. The fabricated strain gauges were attached to the pressure diaphragm and the performance of strain gauge was investigated by measuring with the hydraulic pressure system. The resistance changed linearly with tensile and compressive strains. <strong>Maximum values of non-linearity, hysteresis, thermal coefficient of resistance (TCR) and sensitivity were -0.341 %, 0.909 %, 4128 ppm/°C and 34.22 mV/V respectively. The fabricated strain gauges might be well applicable to the hydrogen pressure sensor which is detectable for high pressure range (0–900 bar).</strong></div></div>\",\"PeriodicalId\":11037,\"journal\":{\"name\":\"Current Applied Physics\",\"volume\":\"69 \",\"pages\":\"Pages 28-35\"},\"PeriodicalIF\":2.4000,\"publicationDate\":\"2024-10-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Current Applied Physics\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1567173924002347\",\"RegionNum\":4,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Current Applied Physics","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1567173924002347","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Design and fabrication of ultrathin silicon-based strain gauges for piezoresistive pressure sensor
Ultra-thin (20 μm) silicon strain gauges were fabricated with silicon-on-insulator (SOI) wafer by a newly-conceived wet etching process. Buffered oxide etchant (BOE, NH4F: HF = 6:1) solution with additives of octylamine and octanol was used for wet etching process in which the operating temperature was 50°C. Photoresist as a passivation layer was deposited on the upper side of SOI wafer to minimize strain gauge damage by chemical etchants. Small amount of octylamine and octanol were added to BOE solution to improve surface wettability and SiO2/Si selectivity. The fabricated strain gauges were attached to the pressure diaphragm and the performance of strain gauge was investigated by measuring with the hydraulic pressure system. The resistance changed linearly with tensile and compressive strains. Maximum values of non-linearity, hysteresis, thermal coefficient of resistance (TCR) and sensitivity were -0.341 %, 0.909 %, 4128 ppm/°C and 34.22 mV/V respectively. The fabricated strain gauges might be well applicable to the hydrogen pressure sensor which is detectable for high pressure range (0–900 bar).
期刊介绍:
Current Applied Physics (Curr. Appl. Phys.) is a monthly published international journal covering all the fields of applied science investigating the physics of the advanced materials for future applications.
Other areas covered: Experimental and theoretical aspects of advanced materials and devices dealing with synthesis or structural chemistry, physical and electronic properties, photonics, engineering applications, and uniquely pertinent measurement or analytical techniques.
Current Applied Physics, published since 2001, covers physics, chemistry and materials science, including bio-materials, with their engineering aspects. It is a truly interdisciplinary journal opening a forum for scientists of all related fields, a unique point of the journal discriminating it from other worldwide and/or Pacific Rim applied physics journals.
Regular research papers, letters and review articles with contents meeting the scope of the journal will be considered for publication after peer review.
The Journal is owned by the Korean Physical Society.