{"title":"基于化学交联网络的 PAAS/GL/GO 抗冷冻导电水凝胶的制备及其在可穿戴传感器中的应用","authors":"Kai Wang, Jiankang Hu, Yutong Zhang, Lei Xiao","doi":"10.1007/s10854-024-13773-0","DOIUrl":null,"url":null,"abstract":"<div><p>Conductive hydrogels have potential applications in the field of wearable devices as carrier materials for flexible strain sensors. In this work, antifreeze filler glycerol (GL) and conductive filler graphene oxide (GO) were introduced into sodium polyacrylate (PAAS) chemical cross-linking network hydrogels, and the PAAS/GO/GL antifreeze conductive hydrogels were prepared by one-pot method. The structures and properties of the hydrogels were characterized and tested. The results showed that the addition of GO improved the mechanical properties and conductivity of the hydrogel. When the addition of GO was 0.6 wt%, the tensile strength of PAAS/GO/GL hydrogel reached the maximum of 0.215 MPa, the corresponding elongation at break reached 1180%, and the conductivity reached 1.056 S<b>·</b>m<sup><b>−</b>1</sup> at room temperature. The addition of GL resulted in good freezing resistance and moisture retention of the hydrogel, with a conductivity of 0.846 S<b>·</b>m<sup><b>−</b>1</sup> even after freezing at −20 °C. The PAAS/GO/GL hydrogel showed good sensing performance. When the tensile deformation reached 600%, the gauge factor (GF) reached 10.82. In addition, PAAS/GO/GL hydrogel also has good self-healing and adhesion, which has potential application value in flexible wearable sensors.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"35 31","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2024-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Preparation of PAAS/GL/GO anti-freezing conductive hydrogels based on chemical cross-linking networks and their application in wearable sensors\",\"authors\":\"Kai Wang, Jiankang Hu, Yutong Zhang, Lei Xiao\",\"doi\":\"10.1007/s10854-024-13773-0\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Conductive hydrogels have potential applications in the field of wearable devices as carrier materials for flexible strain sensors. In this work, antifreeze filler glycerol (GL) and conductive filler graphene oxide (GO) were introduced into sodium polyacrylate (PAAS) chemical cross-linking network hydrogels, and the PAAS/GO/GL antifreeze conductive hydrogels were prepared by one-pot method. The structures and properties of the hydrogels were characterized and tested. The results showed that the addition of GO improved the mechanical properties and conductivity of the hydrogel. When the addition of GO was 0.6 wt%, the tensile strength of PAAS/GO/GL hydrogel reached the maximum of 0.215 MPa, the corresponding elongation at break reached 1180%, and the conductivity reached 1.056 S<b>·</b>m<sup><b>−</b>1</sup> at room temperature. The addition of GL resulted in good freezing resistance and moisture retention of the hydrogel, with a conductivity of 0.846 S<b>·</b>m<sup><b>−</b>1</sup> even after freezing at −20 °C. The PAAS/GO/GL hydrogel showed good sensing performance. When the tensile deformation reached 600%, the gauge factor (GF) reached 10.82. In addition, PAAS/GO/GL hydrogel also has good self-healing and adhesion, which has potential application value in flexible wearable sensors.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"35 31\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-11-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-024-13773-0\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-024-13773-0","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Preparation of PAAS/GL/GO anti-freezing conductive hydrogels based on chemical cross-linking networks and their application in wearable sensors
Conductive hydrogels have potential applications in the field of wearable devices as carrier materials for flexible strain sensors. In this work, antifreeze filler glycerol (GL) and conductive filler graphene oxide (GO) were introduced into sodium polyacrylate (PAAS) chemical cross-linking network hydrogels, and the PAAS/GO/GL antifreeze conductive hydrogels were prepared by one-pot method. The structures and properties of the hydrogels were characterized and tested. The results showed that the addition of GO improved the mechanical properties and conductivity of the hydrogel. When the addition of GO was 0.6 wt%, the tensile strength of PAAS/GO/GL hydrogel reached the maximum of 0.215 MPa, the corresponding elongation at break reached 1180%, and the conductivity reached 1.056 S·m−1 at room temperature. The addition of GL resulted in good freezing resistance and moisture retention of the hydrogel, with a conductivity of 0.846 S·m−1 even after freezing at −20 °C. The PAAS/GO/GL hydrogel showed good sensing performance. When the tensile deformation reached 600%, the gauge factor (GF) reached 10.82. In addition, PAAS/GO/GL hydrogel also has good self-healing and adhesion, which has potential application value in flexible wearable sensors.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.