基于化学交联网络的 PAAS/GL/GO 抗冷冻导电水凝胶的制备及其在可穿戴传感器中的应用

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Kai Wang, Jiankang Hu, Yutong Zhang, Lei Xiao
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引用次数: 0

摘要

导电水凝胶作为柔性应变传感器的载体材料在可穿戴设备领域具有潜在的应用前景。本研究在聚丙烯酸钠(PAAS)化学交联网络水凝胶中引入了抗冻填料甘油(GL)和导电填料氧化石墨烯(GO),并采用一锅法制备了PAAS/GO/GL抗冻导电水凝胶。对水凝胶的结构和性能进行了表征和测试。结果表明,GO 的加入改善了水凝胶的机械性能和导电性。当 GO 的添加量为 0.6 wt% 时,PAAS/GO/GL 水凝胶的拉伸强度达到最大值 0.215 MPa,相应的断裂伸长率达到 1180%,室温下的电导率达到 1.056 S-m-1。添加 GL 后,水凝胶具有良好的抗冻性和保湿性,即使在 -20 °C 下冷冻,其电导率也达到了 0.846 S-m-1。PAAS/GO/GL 水凝胶具有良好的传感性能。当拉伸变形达到 600% 时,测量因子(GF)达到 10.82。此外,PAAS/GO/GL 水凝胶还具有良好的自愈性和粘附性,在柔性可穿戴传感器中具有潜在的应用价值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Preparation of PAAS/GL/GO anti-freezing conductive hydrogels based on chemical cross-linking networks and their application in wearable sensors

Conductive hydrogels have potential applications in the field of wearable devices as carrier materials for flexible strain sensors. In this work, antifreeze filler glycerol (GL) and conductive filler graphene oxide (GO) were introduced into sodium polyacrylate (PAAS) chemical cross-linking network hydrogels, and the PAAS/GO/GL antifreeze conductive hydrogels were prepared by one-pot method. The structures and properties of the hydrogels were characterized and tested. The results showed that the addition of GO improved the mechanical properties and conductivity of the hydrogel. When the addition of GO was 0.6 wt%, the tensile strength of PAAS/GO/GL hydrogel reached the maximum of 0.215 MPa, the corresponding elongation at break reached 1180%, and the conductivity reached 1.056 S·m1 at room temperature. The addition of GL resulted in good freezing resistance and moisture retention of the hydrogel, with a conductivity of 0.846 S·m1 even after freezing at −20 °C. The PAAS/GO/GL hydrogel showed good sensing performance. When the tensile deformation reached 600%, the gauge factor (GF) reached 10.82. In addition, PAAS/GO/GL hydrogel also has good self-healing and adhesion, which has potential application value in flexible wearable sensors.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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