Gaoyi Shang , Yingman Sun , Hao Tang , Xining Li , Shuqi Zhang , Jinzhong Li , Xuandong Liu
{"title":"环氧树脂在电、热和压缩综合应力作用下的降解机理","authors":"Gaoyi Shang , Yingman Sun , Hao Tang , Xining Li , Shuqi Zhang , Jinzhong Li , Xuandong Liu","doi":"10.1016/j.polymdegradstab.2024.111038","DOIUrl":null,"url":null,"abstract":"<div><div>Epoxy resins are widely used in equipment such as ultra-high voltage dry-type bushings, which are subjected to severe electric, thermal, and compressive stresses. Some physical mechanisms have already been proposed to explain the degradations generated by these different stresses, however their effects have not yet been quantified.. The degradation characteristics of epoxy resin under combined stresses of 8 kV/mm, 40 °C-120 °C, and 0–60 MPa were investigated in experiments. The results showed that the degradation characteristics turned significantly with the increase of compressive stress. With the increase in compressive stress, initially the partial discharge initiation voltage, tree initiation voltage and time to breakdown increased, and fractal dimension decreased. While the compressive stress exceeded the turning point, the characteristics were reversed. It can be suggested that opposing mechanisms exist. The free volume and phase field theories dominate at lower and higher stresses, respectively. A novel degradation model of the epoxy resin was proposed based on the theories above. When the compressive stress was low, the reduction of free volume played a dominant role in slowing down the degradation. When the compressive stress was high, the partial energy density concentration accelerated the degradation and played a dominant role. The molecular dynamics and finite element simulation of degradation process stress was carried out and proved consistent with experiments. It confirmed the proposed degradation model reliable and valid.</div></div>","PeriodicalId":406,"journal":{"name":"Polymer Degradation and Stability","volume":"230 ","pages":"Article 111038"},"PeriodicalIF":6.3000,"publicationDate":"2024-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Degradation mechanism for epoxy resins under combined electric, thermal and compressive stresses\",\"authors\":\"Gaoyi Shang , Yingman Sun , Hao Tang , Xining Li , Shuqi Zhang , Jinzhong Li , Xuandong Liu\",\"doi\":\"10.1016/j.polymdegradstab.2024.111038\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Epoxy resins are widely used in equipment such as ultra-high voltage dry-type bushings, which are subjected to severe electric, thermal, and compressive stresses. Some physical mechanisms have already been proposed to explain the degradations generated by these different stresses, however their effects have not yet been quantified.. The degradation characteristics of epoxy resin under combined stresses of 8 kV/mm, 40 °C-120 °C, and 0–60 MPa were investigated in experiments. The results showed that the degradation characteristics turned significantly with the increase of compressive stress. With the increase in compressive stress, initially the partial discharge initiation voltage, tree initiation voltage and time to breakdown increased, and fractal dimension decreased. While the compressive stress exceeded the turning point, the characteristics were reversed. It can be suggested that opposing mechanisms exist. The free volume and phase field theories dominate at lower and higher stresses, respectively. A novel degradation model of the epoxy resin was proposed based on the theories above. When the compressive stress was low, the reduction of free volume played a dominant role in slowing down the degradation. When the compressive stress was high, the partial energy density concentration accelerated the degradation and played a dominant role. The molecular dynamics and finite element simulation of degradation process stress was carried out and proved consistent with experiments. It confirmed the proposed degradation model reliable and valid.</div></div>\",\"PeriodicalId\":406,\"journal\":{\"name\":\"Polymer Degradation and Stability\",\"volume\":\"230 \",\"pages\":\"Article 111038\"},\"PeriodicalIF\":6.3000,\"publicationDate\":\"2024-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Polymer Degradation and Stability\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0141391024003811\",\"RegionNum\":2,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"POLYMER SCIENCE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer Degradation and Stability","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0141391024003811","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
Degradation mechanism for epoxy resins under combined electric, thermal and compressive stresses
Epoxy resins are widely used in equipment such as ultra-high voltage dry-type bushings, which are subjected to severe electric, thermal, and compressive stresses. Some physical mechanisms have already been proposed to explain the degradations generated by these different stresses, however their effects have not yet been quantified.. The degradation characteristics of epoxy resin under combined stresses of 8 kV/mm, 40 °C-120 °C, and 0–60 MPa were investigated in experiments. The results showed that the degradation characteristics turned significantly with the increase of compressive stress. With the increase in compressive stress, initially the partial discharge initiation voltage, tree initiation voltage and time to breakdown increased, and fractal dimension decreased. While the compressive stress exceeded the turning point, the characteristics were reversed. It can be suggested that opposing mechanisms exist. The free volume and phase field theories dominate at lower and higher stresses, respectively. A novel degradation model of the epoxy resin was proposed based on the theories above. When the compressive stress was low, the reduction of free volume played a dominant role in slowing down the degradation. When the compressive stress was high, the partial energy density concentration accelerated the degradation and played a dominant role. The molecular dynamics and finite element simulation of degradation process stress was carried out and proved consistent with experiments. It confirmed the proposed degradation model reliable and valid.
期刊介绍:
Polymer Degradation and Stability deals with the degradation reactions and their control which are a major preoccupation of practitioners of the many and diverse aspects of modern polymer technology.
Deteriorative reactions occur during processing, when polymers are subjected to heat, oxygen and mechanical stress, and during the useful life of the materials when oxygen and sunlight are the most important degradative agencies. In more specialised applications, degradation may be induced by high energy radiation, ozone, atmospheric pollutants, mechanical stress, biological action, hydrolysis and many other influences. The mechanisms of these reactions and stabilisation processes must be understood if the technology and application of polymers are to continue to advance. The reporting of investigations of this kind is therefore a major function of this journal.
However there are also new developments in polymer technology in which degradation processes find positive applications. For example, photodegradable plastics are now available, the recycling of polymeric products will become increasingly important, degradation and combustion studies are involved in the definition of the fire hazards which are associated with polymeric materials and the microelectronics industry is vitally dependent upon polymer degradation in the manufacture of its circuitry. Polymer properties may also be improved by processes like curing and grafting, the chemistry of which can be closely related to that which causes physical deterioration in other circumstances.