盐雾和电化学工作站条件下铁基覆层的耐腐蚀性能研究

IF 5.3 2区 材料科学 Q1 MATERIALS SCIENCE, COATINGS & FILMS
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引用次数: 0

摘要

本研究旨在评估在中性盐雾和 3.5 wt% 氯化钠环境下 27SiMn 钢基体上形成的铁基合金镀层的电化学特性。通过采用高速激光熔覆技术,制备了铁基熔覆层,并对其进行了微观结构和电化学特性分析。使用扫描电子显微镜(SEM)、电子反向散射衍射(EBSD)和 X 射线衍射(XRD)分析了涂层的微观结构和相位,并使用盐雾腐蚀室和电化学工作站讨论了其腐蚀性能。结果表明,涂层表面的微观结构包含等轴晶和长树枝状晶体,这是因为包覆过程后的凝固速率较高而产生的。铁基涂层的整个微观结构中富含铁铬相,没有形成金属间化合物。与基体相比,在不同的腐蚀时间后,涂层的腐蚀表面趋于致密,含有少量腐蚀坑,这归因于其上氧化铬的形成。电位极化曲线(PPC)和电化学阻抗谱(EIS)的电化学测试表明,涂层的耐腐蚀性优于基体,具有更高的腐蚀电位(-0.298 V)、更低的被动电流密度(1.36 × 10-6 A-cm2)和更高的电荷转移电阻(8.23 × 106 Ω-cm2)。此外,盐雾和电化学测试中涂层的腐蚀机理是局部点蚀,这是由于局部区域的自催化作用促进了 Cl- 离子穿透涂层并导致铁和铬氧化物的溶解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of corrosion resistance offered by the Fe-based clad layer under salt spray and electrochemical workstations
The present work aims to evaluate the electrochemical characteristics of the Fe–based alloy coating formed on the 27SiMn steel substrate under neutral salt spray and 3.5 wt% NaCl environments. By adopting the high-speed laser cladding technique, the Fe-based clad layer was fabricated to perform microstructural and electrochemical characterizations. The microstructure and phase of the coating were analyzed using a scanning electron microscope (SEM), electron backscatter diffraction (EBSD) and X-ray diffraction (XRD), and its corrosion performance was also discussed using the salt spray corrosion chamber and the electrochemical workstation. The results show that the microstructure of the coating surface contains equiaxed crystals and long dendritic crystals which arise due to the higher solidification rate after the cladding process. The Fe–based coating was rich in FeCr phase throughout its microstructure without the formation of the intermetallic compounds. Compared to the substrate, the corroded surface of the coating tends to be compact containing a few corrosion pits after different corrosion times, which is attributed to the formation of Cr oxide on it. The electrochemical tests on the potentiodynamic polarization curve (PPC) and electrochemical impedance spectrum (EIS) indicate that the corrosion resistance of the coating is superior to the substrate, presenting a higher corrosion potential (−0.298 V), lower passive current density (1.36 × 10−6 A•cm2), and higher charge transfer resistance (8.23 × 106 Ω·cm2). Additionally, the corrosion mechanism of coating in salt spray and electrochemical tests is the local pitting corrosion due to the autocatalytic effect on the localized region, which facilitates Cl ions penetrating the coating and leads to the dissolution of Fe and Cr oxides.
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来源期刊
Surface & Coatings Technology
Surface & Coatings Technology 工程技术-材料科学:膜
CiteScore
10.00
自引率
11.10%
发文量
921
审稿时长
19 days
期刊介绍: Surface and Coatings Technology is an international archival journal publishing scientific papers on significant developments in surface and interface engineering to modify and improve the surface properties of materials for protection in demanding contact conditions or aggressive environments, or for enhanced functional performance. Contributions range from original scientific articles concerned with fundamental and applied aspects of research or direct applications of metallic, inorganic, organic and composite coatings, to invited reviews of current technology in specific areas. Papers submitted to this journal are expected to be in line with the following aspects in processes, and properties/performance: A. Processes: Physical and chemical vapour deposition techniques, thermal and plasma spraying, surface modification by directed energy techniques such as ion, electron and laser beams, thermo-chemical treatment, wet chemical and electrochemical processes such as plating, sol-gel coating, anodization, plasma electrolytic oxidation, etc., but excluding painting. B. Properties/performance: friction performance, wear resistance (e.g., abrasion, erosion, fretting, etc), corrosion and oxidation resistance, thermal protection, diffusion resistance, hydrophilicity/hydrophobicity, and properties relevant to smart materials behaviour and enhanced multifunctional performance for environmental, energy and medical applications, but excluding device aspects.
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