利用聚合物衍生陶瓷和 In2O3 复合材料打印高灵敏度应变片，用于高温应用

IF 8.3 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

ACS Applied Materials & Interfaces Pub Date : 2024-10-24 DOI:10.1016/j.surfin.2024.105324

Xianwei Qian, Lida Xu, Le Su, Lantian Tang, Shiye Ouyang, Xiong Zhou, Muhan Wu, Chao Wu, Lingyun Wang

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引用次数: 0

摘要

开发兼具耐用性和高测量系数（GF）的高温厚膜应变片（TFSG）仍然是一项艰巨的挑战。本研究将聚合物衍生陶瓷技术与填料技术相结合，推出了 SiCNO/In2O3 TFSG。所提出的 TFSG 具有稳定的应变响应和优异的热稳定性，因此可在高达 1100 °C 的温度下使用。值得注意的是，SiCNO/In2O3 TFSG 在 1100 °C 时的电阻漂移极小，仅为 0.31 %/h，而在 1000 °C 时的 GF 值为 10.94，令人印象深刻。这些进步凸显了其在推进系统和工业流程等需要在苛刻热条件下进行精确应变监测的应用中的巨大潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Printing highly sensitive strain gauges with polymer-derived ceramics and In2O3 composites for high-temperature applications

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Printing highly sensitive strain gauges with polymer-derived ceramics and In2O3 composites for high-temperature applications

The development of high-temperature thick film strain gauges (TFSGs) that offer both durability and a high gauge factor (GF) remains a formidable challenge. This study integrates polymer-derived ceramic technology with filler techniques to introduce the SiCNO/In₂O₃ TFSG. The proposed TFSG demonstrates a stable strain response and exceptional thermal stability, enabling its application at temperatures up to 1100 °C. Notably, the SiCNO/In₂O₃ TFSG exhibits minimal resistance drift of 0.31 %/h at 1100 °C, and an impressive GF of 10.94 at 1000 °C. These advancements underscore its significant potential for applications requiring precise strain monitoring under harsh thermal conditions, such as propulsion systems and industrial processes.

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来源期刊

ACS Applied Materials & Interfaces 工程技术-材料科学：综合

CiteScore

16.00

自引率

6.30%

发文量

4978

审稿时长

1.8 months

期刊介绍： ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.