Zhen-xia LIU , Da-wei YUAN , Xin LUO , Lan-hao WANG , Jin-shui CHEN , Hui-ming CHEN , Xiang-peng XIAO , Bin YANG
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Influence of thermomechanical treatment on recrystallization and softening resistance of Cu−6.5Fe−0.3Mg alloy
The recrystallization and softening resistance of a Cu−6.5Fe−0.3Mg (mass fraction, %) alloy prepared by Process 1 (cold rolling heat treatment) and Process 2 (hot/cold rolling heat treatment) were studied using Vickers hardness tests, tensile tests, scanning electron microscopy and transmission electron microscopy. The softening temperature, hardness and tensile strength of the alloy prepared by Process 2 were 110 °C, HV 15 and 114 MPa higher, respectively, than those of the alloy prepared by Process 1 after aging at 300 °C. The recrystallization activation energy of the alloys prepared by Process 1 and Process 2 were 72.83 and 98.11 kJ/mol, respectively. The pinning effects of the precipitates of the two alloys on grain boundaries and dislocations were basically the same. The softening mechanism was mainly attributed to the loss of dislocation strengthening. The higher Fe fiber density inhibited the average free migration path of dislocations and grain boundary migration in the alloy, which was the main reason for higher softening temperature of the alloy prepared by Process 2.
期刊介绍:
The Transactions of Nonferrous Metals Society of China (Trans. Nonferrous Met. Soc. China), founded in 1991 and sponsored by The Nonferrous Metals Society of China, is published monthly now and mainly contains reports of original research which reflect the new progresses in the field of nonferrous metals science and technology, including mineral processing, extraction metallurgy, metallic materials and heat treatments, metal working, physical metallurgy, powder metallurgy, with the emphasis on fundamental science. It is the unique preeminent publication in English for scientists, engineers, under/post-graduates on the field of nonferrous metals industry. This journal is covered by many famous abstract/index systems and databases such as SCI Expanded, Ei Compendex Plus, INSPEC, CA, METADEX, AJ and JICST.