热迁移和电流应力对 Sn58Bi 焊料阻尼能力的协同效应

IF 3.8 2区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Vacuum Pub Date : 2024-10-21 DOI:10.1016/j.vacuum.2024.113760

Feng Chen , Lanqing Mo , Fei Hu , Wangyun Li , Song Wei

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引用次数: 0

摘要

为了评估 Sn58Bi 焊料在电子设备中的抗振性，在电流应力（0、4.0 和 8.0 A）作用下，在 2000 °C/cm 的温度梯度下进行不同时间（0、120、360、720 和 1440 h）的热迁移（TM）试验后，对 Sn58Bi 焊料的阻尼能力进行了表征。结果表明，TM 测试 Sn58Bi 焊料的相分离决定了焊料的阻尼性能。富铋层随着 TM 时间的延长而增厚，并从高温向低温方向迁移。应变-振幅相关阻尼容量曲线的临界应变（位错摆脱钉点的值）都随着 TM 时间的延长而增加，同时随着电流的增加而减小。此外，应变振幅相关阻尼容量和温度相关阻尼容量随 TM 时间的延长呈总体下降趋势，而随电流的增加呈指数增长。此外，随着温度的升高，阻尼机制从位错运动转变为相界滑动，过渡温度随电流的增加而降低，但一般随 TM 时间的增加而升高。

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Synergistic effect of thermomigration and electric current stressing on damping capacity of Sn58Bi solder

In order to evaluate the vibration resistance of Sn58Bi solder in serving electronic devices, the damping capacities of Sn58Bi solders after thermomigration (TM) test at a temperature gradient of 2000 °C/cm for different time (0, 120, 360, 720, and 1440 h) were characterized under electric current stressing (0, 4.0, and 8.0 A). The results indicate that the phase segregation of TM-tested Sn58Bi solders determines the damping performance of solders. The Bi-rich layer thickens with prolonged TM time and migrates in the direction from high temperature to low temperature. Both the critical strains (the values of dislocation getting rid of pining points) of strain-amplitude-related damping capacity curves increases with prolonged TM time, while decreases with increasing electric current. Moreover, both strain-amplitude-related and temperature-related damping capacity shows a general decreasing trend with prolonged TM time, while increases exponentially with increasing electric current. In addition, the damping mechanism changes from dislocation motion to phase boundary sliding with increasing temperature, and the transition temperature decreases with increasing current but generally increases with TM time.

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来源期刊

Vacuum 工程技术-材料科学：综合

CiteScore

6.80

自引率

17.50%

发文量

审稿时长

34 days

期刊介绍： Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.