Research on the reliability of wire web in diamond multi-wire saw slicing photovoltaic monocrystalline silicon wafer

Diamond multi-wire slicing technology is the main method for producing the solar cell substrate based on monocrystalline silicon. To reduce the production cost and increase the production efficiency during the sawing process, the diameter of the diamond saw wire is becoming thinner, and the sawing speed is getting faster, which leads to an increasingly prominent problem of saw wire breakage during the slicing process. To understand the breaking characteristics of diamond saw wire and evaluate the reliability of the saw wire during the sawing process, the tensile testing of saw wires was carried out in this paper. And based on the Weibull function, the breaking force was analyzed statistically. A maximum tension force model for the saw wire during the sawing process was established. And based on the maximum tension force model and Weibull reliability function, the influence of various process parameters on the reliability of the wire web was analyzed. The results indicated that as the usage time of the saw wire increases, the breaking force gradually decreases and stabilizes. Compared to the fresh saw wire, the reliability of the used saw wires is significantly reduced. As the abrasive distribution density and the wire speed increases, the reliability of the wire web gradually increases. Conversely, as the feed speed and the pretension of the saw wire increase, the reliability of the wire web gradually decrease. The results of this paper provide a theoretical approach for assessing the reliability of diamond saw wire web during the sawing process. It also provides guidance for optimizing process parameters to enhance the reliability of the wire web.