合成用于蔗糖传感的部分嵌入式双金属金银纳米结构

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Ksh. Devarani Devi, Aditya Sharma, Sunil Ojha, Jai Parkash, Fouran Singh
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引用次数: 0

摘要

对沉积在玻璃基板上的 5 纳米金薄膜进行 30 keV Ag 离子注入,可产生部分嵌入的双金属金银合金纳米结构。利用低能量琼脂离子注入同时实现了两个目标:首先,辐照金薄膜;其次,将银原子纳入玻璃基板。使用原子力显微镜(AFM)进行的研究表明,琼脂离子植入在玻璃基底上形成了部分嵌入的不规则形状和球形的纳米结构。颗粒的平均尺寸为 (37.5 ± 6.8) nm,高度分布在 0 到 12 nm 之间。颗粒之间的平均分离距离为 131 nm,表明分离效果良好。利用卢瑟福背散射光谱法(RBS)进行的测量显示,金原子与主基质中的银原子混合,表明合金已经形成。此外,紫外可见光(表面等离子体共振)吸收研究结果表明,吸收光谱中只有一个 SPR 吸收峰,这也支持了在玻璃基底中合成双金属金银合金纳米粒子(NPs)。玻璃表面部分嵌入合金纳米结构的产生机理可解释为火山口形成、溅射、颗粒间扩散以及低能量琼脂离子注入引起的热尖峰混合。在这些包含部分嵌入式双金属金银合金纳米结构的玻璃薄膜上,对蔗糖传感进行了探索。无需探针,双金属 AuAg 合金纳米结构的 SPR 就能有效检测蔗糖溶液,在 1 nM 蔗糖溶液中显示出明显的蓝移(约 11 nm)。然而,随着蔗糖溶液浓度的进一步增加,SPR 位置没有变化。结果表明,1 nM 蔗糖溶液完全覆盖了 NPs,检测限明显低于 1 nM 蔗糖溶液。研究结果表明,这种传感反应在生物分子传感方面具有潜在的应用价值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Synthesis of partially embedded bimetallic gold-silver nanostructures for sucrose sensing applications

30 keV Ag ion implantation on Au thin film, 5 nm, deposited on glass substrates produces partially embedded bimetallic AuAg alloy nanostructures. Low energy Ag ion implantation is utilized to simultaneously achieve two objectives: first, it irradiates the Au thin layer, and second, it incorporates Ag atoms into the glass substrates. The investigations using Atomic Force Microscopy (AFM) reveal that the Ag- ion implantation caused nanostructuring of the partially embedded irregularly shaped and spherical shaped nanostructures on glass substrates. The particle mean size is (37.5 ± 6.8) nm and the height profiles vary from 0 to 12 nm. The average separation distance between the particles is 131 nm, which indicates good separation. Measurements with Rutherford Backscattering Spectrometry (RBS) show mixing of Au atoms with Ag atoms in the host substrate, indicating alloy formation. Further, the results of UV–Vis (Surface Plasmon Resonance) absorption studies show only one SPR absorbance peak in the absorption spectra, that also support the synthesis of bimetallic AuAg alloy nanoparticles (NPs) in glass substrates. The mechanisms of production of partially embedded alloy nanostructure on the glass surface are explained by crater formation, sputtering; inter particle diffusion and mixing due to thermal spike caused by low energy Ag ion implantation. Sucrose sensing has been explored on these glass thin films comprising partially embedded bimetallic AuAg alloy nanostructures. Without the need for a probe, the SPRs of bimetallic AuAg alloy nanostructures are effective in detecting sucrose solutions, showing a noticeable blue shift (~ 11 nm) to 1 nM sucrose solution. However, there is no change in SPR position with further increase in concentration of sucrose solution. The result indicates complete coverage of NPs with 1 nM sucrose solution and detection limit is significantly lower than that of a 1 nM sucrose solution. The findings show that the sensing responses have potential applications in sensing of biomolecules.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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