Lianghuan Wei, Tianhao Dong, Yongpeng Cui, Shengjie Zhu, Jianxiao Si
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引用次数: 0
摘要
基于无机延展纤维材料的柔性热电(TE)器件的一个潜在应用是开发自供电的可穿戴电子设备。该研究采用熔融拉丝法制造无机延展性 Ag2S0.7Te0.3 纤维。在温差为 50 K 的条件下,单根光纤的输出电压和最大输出功率分别为 3.3 mV 和 837.4 nW。Ag2S0.7Te0.3 光纤在临界电密度为 36 A cm-2 的服役稳定性测试中表现出优异的稳定性能,拉伸应变为 5%。Ag2S0.7Te0.3 纤维 TE 器件的高温度灵敏度证明了其在可穿戴电子产品中的应用潜力。
Molten drawing inorganic ductile Ag2S0.7Te0.3 fibers with high thermoelectric performance and stability
One potential application for flexible thermoelectric (TE) devices based on inorganic ductile fiber materials is the development of self-powered wearable electronics. In the work, the molten drawing method was employed for fabricating inorganic ductile Ag2S0.7Te0.3 fibers. The output voltage and maximum output power of the single fiber are 3.3 mV and 837.4 nW, respectively, under a temperature difference of 50 K. The Ag2S0.7Te0.3 fiber shows outstanding stability performance in the service stability test with a critical electric density of 36 A cm−2 and exhibits a tensile strain of 5%. The high temperature sensitivity of the Ag2S0.7Te0.3 fibers TE device demonstrates the application potential in wearable electronics products.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.