多材料增材制造电子器件和四维打印/原形记忆器件综述:设计、制造和实现

IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Yang Yang;Zhiwei Yin;Xuyi Zhu;Hani Al Jamal;Xiaojing Lv;Kexin Hu;Marvin Joshi;Nathan Wille;Mengze Li;Bing Zhang;Zhen Luo;Shlomo Magdassi;Manos Tentzeris
{"title":"多材料增材制造电子器件和四维打印/原形记忆器件综述:设计、制造和实现","authors":"Yang Yang;Zhiwei Yin;Xuyi Zhu;Hani Al Jamal;Xiaojing Lv;Kexin Hu;Marvin Joshi;Nathan Wille;Mengze Li;Bing Zhang;Zhen Luo;Shlomo Magdassi;Manos Tentzeris","doi":"10.1109/JPROC.2024.3471849","DOIUrl":null,"url":null,"abstract":"Emerging additive manufacturing (AM) technologies, specifically additively manufactured electronics (AME), 4-D printing, and origami, are reshaping the design capabilities and functionalities of contemporary electronic devices. Cutting-edge 3-D/4-D printing technologies facilitate the prototyping and realization of complex electronic functions that are challenging to conventional methods. This article provides a comprehensive overview of the evolving techniques in AME, 4-D printing, and origami, employing multimaterials (conductive and dielectric materials) and shape-memory materials (SMMs) to fabricate functional electronic components and devices. Additionally, the overview delves into the state-of-the-art AME and 4-D-printed electronic components across diverse fields, including biomedical electronics, space engineering, and the advancements in the next-generation wireless communications and sensing.","PeriodicalId":20556,"journal":{"name":"Proceedings of the IEEE","volume":"112 8","pages":"954-999"},"PeriodicalIF":23.2000,"publicationDate":"2024-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10733954","citationCount":"0","resultStr":"{\"title\":\"A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation\",\"authors\":\"Yang Yang;Zhiwei Yin;Xuyi Zhu;Hani Al Jamal;Xiaojing Lv;Kexin Hu;Marvin Joshi;Nathan Wille;Mengze Li;Bing Zhang;Zhen Luo;Shlomo Magdassi;Manos Tentzeris\",\"doi\":\"10.1109/JPROC.2024.3471849\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Emerging additive manufacturing (AM) technologies, specifically additively manufactured electronics (AME), 4-D printing, and origami, are reshaping the design capabilities and functionalities of contemporary electronic devices. Cutting-edge 3-D/4-D printing technologies facilitate the prototyping and realization of complex electronic functions that are challenging to conventional methods. This article provides a comprehensive overview of the evolving techniques in AME, 4-D printing, and origami, employing multimaterials (conductive and dielectric materials) and shape-memory materials (SMMs) to fabricate functional electronic components and devices. Additionally, the overview delves into the state-of-the-art AME and 4-D-printed electronic components across diverse fields, including biomedical electronics, space engineering, and the advancements in the next-generation wireless communications and sensing.\",\"PeriodicalId\":20556,\"journal\":{\"name\":\"Proceedings of the IEEE\",\"volume\":\"112 8\",\"pages\":\"954-999\"},\"PeriodicalIF\":23.2000,\"publicationDate\":\"2024-10-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10733954\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10733954/\",\"RegionNum\":1,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10733954/","RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

新兴的增材制造(AM)技术,特别是增材制造电子设备(AME)、四维打印和折纸,正在重塑当代电子设备的设计能力和功能。尖端的三维/四维打印技术为复杂电子功能的原型设计和实现提供了便利,而这些功能对传统方法来说具有挑战性。本文全面概述了不断发展的 AME、4-D 打印和折纸技术,这些技术采用多材料(导电和介电材料)和形状记忆材料 (SMM) 制造功能电子元件和设备。此外,该概览还深入探讨了最先进的 AME 和 4-D 印刷电子元件,涉及多个领域,包括生物医学电子学、空间工程以及下一代无线通信和传感技术的发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation
Emerging additive manufacturing (AM) technologies, specifically additively manufactured electronics (AME), 4-D printing, and origami, are reshaping the design capabilities and functionalities of contemporary electronic devices. Cutting-edge 3-D/4-D printing technologies facilitate the prototyping and realization of complex electronic functions that are challenging to conventional methods. This article provides a comprehensive overview of the evolving techniques in AME, 4-D printing, and origami, employing multimaterials (conductive and dielectric materials) and shape-memory materials (SMMs) to fabricate functional electronic components and devices. Additionally, the overview delves into the state-of-the-art AME and 4-D-printed electronic components across diverse fields, including biomedical electronics, space engineering, and the advancements in the next-generation wireless communications and sensing.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Proceedings of the IEEE
Proceedings of the IEEE 工程技术-工程:电子与电气
CiteScore
46.40
自引率
1.00%
发文量
160
审稿时长
3-8 weeks
期刊介绍: Proceedings of the IEEE is the leading journal to provide in-depth review, survey, and tutorial coverage of the technical developments in electronics, electrical and computer engineering, and computer science. Consistently ranked as one of the top journals by Impact Factor, Article Influence Score and more, the journal serves as a trusted resource for engineers around the world.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信