同源染色体 DNA 与外源供体 DNA 竞争修复黑曲霉中 CRISPR/Cas9 诱导的双链断裂。

Q1 Agricultural and Biological Sciences
Selina Forrer, Mark Arentshorst, Prajeesh Koolth Valappil, Jaap Visser, Arthur F J Ram
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引用次数: 0

摘要

背景:黑曲霉以其高蛋白分泌能力而闻名,因此是生产同源和异源蛋白的重要细胞工厂。使用强启动子和多基因拷贝是提高相关基因(GOI)的基因表达和蛋白质产量的常用策略。我们最近提出了一种由 CRISPR/Cas9 介导的两步法,即在基因组中的预定位点引入葡萄糖淀粉酶(glaA)着陆点(GLSs)(第一步),随后用 GOI 的拷贝填充这些着陆点(第二步),以实现 GOI 的高表达:结果:我们在这里发现,在黑僵菌 ku70 缺陷菌株(Δku70)中,染色体 glaA 基因座或同源 GLS 可用于修复 Cas9 诱导的 DSB,从而与含有 GOI 的供体 DNA 的整合竞争,从而排除了非同源末端连接(NHEJ)这一修复双链 DNA 断裂(DSB)的机制。在没有外源添加供体DNA的情况下,DSB会被位于其他染色体上的同源染色体DNA修复(染色体间修复),或者被位于同一染色体上的同源DNA片段修复(染色体内修复),后者的效率更高。研究发现,13%-20% 的转化子发生了单拷贝染色体间同源 DNA 修复,而 80%-87% 的转化子则由外源添加的供体 DNA 修复。染色体修复的效率取决于基因组中潜在供体 DNA 序列的拷贝数。如果存在五个同源的 DNA 序列,则通过染色体 DNA 修复的转化子数量会增加(35-61%)。研究发现,在没有供体 DNA 的情况下,基于染色体内同源的 DSB 修复效率(85-90%)要比染色体间修复高。在有供体 DNA 存在的情况下,染色体内修复也被认为是首选的 DNA 修复方式,而且这种修复方式与基因位点有关:结论:同源染色体 DNA 修复可与供体 DNA 竞争修复 DSB,从而影响利用 CRISPR/Cas9 介导的基因组编辑构建多拷贝菌株的效率,这是工业化菌株设计中需要考虑的一个重要因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Competition between homologous chromosomal DNA and exogenous donor DNA to repair CRISPR/Cas9-induced double-strand breaks in Aspergillus  niger.

Background: Aspergillus niger is well-known for its high protein secretion capacity and therefore an important cell factory for homologous and heterologous protein production. The use of a strong promoter and multiple gene copies are commonly used strategies to increase the gene expression and protein production of the gene of interest (GOI). We recently presented a two-step CRISPR/Cas9-mediated approach in which glucoamylase (glaA) landing sites (GLSs) are introduced at predetermined sites in the genome (step 1), which are subsequently filled with copies of the GOI (step 2) to achieve high expression of the GOI.

Results: Here we show that in a ku70 defective A. niger strain (Δku70), thereby excluding non-homologous end joining (NHEJ) as a mechanism to repair double-stranded DNA breaks (DSBs), the chromosomal glaA locus or homologous GLSs can be used to repair Cas9-induced DSBs, thereby competing with the integration of the donor DNA containing the GOI. In the absence of exogenously added donor DNA, the DSBs are repaired with homologous chromosomal DNA located on other chromosomes (inter-chromosomal repair) or, with higher efficiency, by a homologous DNA fragment located on the same chromosome (intra-chromosomal repair). Single copy inter-chromosomal homology-based DNA repair was found to occur in 13-20% of the transformants while 80-87% of the transformants were repaired by exogenously added donor DNA. The efficiency of chromosomal repair was dependent on the copy number of the potential donor DNA sequences in the genome. The presence of five homologous DNA sequences, resulted in an increased number (35-61%) of the transformants repaired by chromosomal DNA. The efficiency of intra-chromosomal homology based DSB repair in the absence of donor DNA was found to be highly preferred (85-90%) over inter-chromosomal repair. Intra-chromosomal repair was also found to be the preferred way of DNA repair in the presence of donor DNA and was found to be locus-dependent.

Conclusion: The awareness that homologous chromosomal DNA repair can compete with donor DNA to repair DSB and thereby affecting the efficiency of multicopy strain construction using CRISPR/Cas9-mediated genome editing is an important consideration to take into account in industrial strain design.

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来源期刊
Fungal Biology and Biotechnology
Fungal Biology and Biotechnology Agricultural and Biological Sciences-Ecology, Evolution, Behavior and Systematics
CiteScore
10.20
自引率
0.00%
发文量
17
审稿时长
9 weeks
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