使用 FBG 传感器、DIC 技术和应变计测量层压复合材料残余应力的比较研究

IF 3.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
R. Pashaie, M. M. Shokrieh, M. Vahedi, A. H. Mirzaei, S. Akbari
{"title":"使用 FBG 传感器、DIC 技术和应变计测量层压复合材料残余应力的比较研究","authors":"R. Pashaie,&nbsp;M. M. Shokrieh,&nbsp;M. Vahedi,&nbsp;A. H. Mirzaei,&nbsp;S. Akbari","doi":"10.1007/s11082-024-07676-x","DOIUrl":null,"url":null,"abstract":"<div><p>Residual stresses adversely influence the strength of polymeric composites and could result in premature failure, warpage, delamination, and matrix cracking. Therefore, residual stress measurement is necessary to predict their effects on the performance of polymeric composites. The primary focus of this study is to compare the performance of the fiber Bragg grating (FBG) sensor for residual stress measurement with that of the digital image correlation (DIC) and strain gauge which are the most commonly used methods in this field. This comparison is of significant importance as it can provide valuable insights into the effectiveness of these techniques in measuring cure-induced residual stresses in polymeric composites. The incremental slitting process was conducted to compare the accuracy and the performance of the FBG sensor with the DIC and strain gauge. The residual stresses were also evaluated using the classical lamination theory (CLT). The 2% difference was achieved between the recorded data by FBGs before and after slitting. The present study also involves monitoring the curing cycle and determining the created residual strains at the end of this process using the FBGs without resorting to destructive methods such as hole-drilling or slitting.</p></div>","PeriodicalId":720,"journal":{"name":"Optical and Quantum Electronics","volume":null,"pages":null},"PeriodicalIF":3.3000,"publicationDate":"2024-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A comparative study of residual stress measurement of laminated composites using FBG sensor, DIC technique, and strain gauge\",\"authors\":\"R. Pashaie,&nbsp;M. M. Shokrieh,&nbsp;M. Vahedi,&nbsp;A. H. Mirzaei,&nbsp;S. Akbari\",\"doi\":\"10.1007/s11082-024-07676-x\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Residual stresses adversely influence the strength of polymeric composites and could result in premature failure, warpage, delamination, and matrix cracking. Therefore, residual stress measurement is necessary to predict their effects on the performance of polymeric composites. The primary focus of this study is to compare the performance of the fiber Bragg grating (FBG) sensor for residual stress measurement with that of the digital image correlation (DIC) and strain gauge which are the most commonly used methods in this field. This comparison is of significant importance as it can provide valuable insights into the effectiveness of these techniques in measuring cure-induced residual stresses in polymeric composites. The incremental slitting process was conducted to compare the accuracy and the performance of the FBG sensor with the DIC and strain gauge. The residual stresses were also evaluated using the classical lamination theory (CLT). The 2% difference was achieved between the recorded data by FBGs before and after slitting. The present study also involves monitoring the curing cycle and determining the created residual strains at the end of this process using the FBGs without resorting to destructive methods such as hole-drilling or slitting.</p></div>\",\"PeriodicalId\":720,\"journal\":{\"name\":\"Optical and Quantum Electronics\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":3.3000,\"publicationDate\":\"2024-10-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Optical and Quantum Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s11082-024-07676-x\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optical and Quantum Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s11082-024-07676-x","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

残余应力会对聚合物复合材料的强度产生不利影响,并可能导致过早失效、翘曲、分层和基体开裂。因此,有必要对残余应力进行测量,以预测其对聚合物复合材料性能的影响。本研究的主要重点是比较用于残余应力测量的光纤布拉格光栅(FBG)传感器与数字图像相关(DIC)和应变计的性能,后者是该领域最常用的方法。这种比较具有重要意义,因为它可以为了解这些技术在测量聚合物复合材料固化引起的残余应力方面的有效性提供有价值的见解。为了比较 FBG 传感器与 DIC 和应变计的精度和性能,我们采用了增量式分切工艺。此外,还使用经典层压理论(CLT)对残余应力进行了评估。分切前后 FBG 记录的数据相差 2%。本研究还涉及使用 FBG 监测固化周期并确定固化过程结束时产生的残余应变,而无需采用钻孔或分切等破坏性方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

A comparative study of residual stress measurement of laminated composites using FBG sensor, DIC technique, and strain gauge

A comparative study of residual stress measurement of laminated composites using FBG sensor, DIC technique, and strain gauge

Residual stresses adversely influence the strength of polymeric composites and could result in premature failure, warpage, delamination, and matrix cracking. Therefore, residual stress measurement is necessary to predict their effects on the performance of polymeric composites. The primary focus of this study is to compare the performance of the fiber Bragg grating (FBG) sensor for residual stress measurement with that of the digital image correlation (DIC) and strain gauge which are the most commonly used methods in this field. This comparison is of significant importance as it can provide valuable insights into the effectiveness of these techniques in measuring cure-induced residual stresses in polymeric composites. The incremental slitting process was conducted to compare the accuracy and the performance of the FBG sensor with the DIC and strain gauge. The residual stresses were also evaluated using the classical lamination theory (CLT). The 2% difference was achieved between the recorded data by FBGs before and after slitting. The present study also involves monitoring the curing cycle and determining the created residual strains at the end of this process using the FBGs without resorting to destructive methods such as hole-drilling or slitting.

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来源期刊
Optical and Quantum Electronics
Optical and Quantum Electronics 工程技术-工程:电子与电气
CiteScore
4.60
自引率
20.00%
发文量
810
审稿时长
3.8 months
期刊介绍: Optical and Quantum Electronics provides an international forum for the publication of original research papers, tutorial reviews and letters in such fields as optical physics, optical engineering and optoelectronics. Special issues are published on topics of current interest. Optical and Quantum Electronics is published monthly. It is concerned with the technology and physics of optical systems, components and devices, i.e., with topics such as: optical fibres; semiconductor lasers and LEDs; light detection and imaging devices; nanophotonics; photonic integration and optoelectronic integrated circuits; silicon photonics; displays; optical communications from devices to systems; materials for photonics (e.g. semiconductors, glasses, graphene); the physics and simulation of optical devices and systems; nanotechnologies in photonics (including engineered nano-structures such as photonic crystals, sub-wavelength photonic structures, metamaterials, and plasmonics); advanced quantum and optoelectronic applications (e.g. quantum computing, memory and communications, quantum sensing and quantum dots); photonic sensors and bio-sensors; Terahertz phenomena; non-linear optics and ultrafast phenomena; green photonics.
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