根据第一原理预测合金元素(镍、钴、铬和锡)对 W-Cu 合金体系机械性能的影响

IF 3.5 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Zengye Ning, Xiuqing Li, Shizhong Wei, Jingkun Liang, Jie Wu, Xinyu Zhang, Haiyang Pei, Liujie Xu, Yucheng Zhou
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引用次数: 0

摘要

为了探讨合金元素 X(X = Ni、Co、Cr 和 Sn)对 W-Cu 合金强度、硬度和韧性影响的原因,本文基于第一性原理计算了 W-Cu 合金和 W-X-Cu 合金的弹性常数和电子结构,并从原子水平定量评价了合金元素 X 对 W-Cu 合金强度、硬度和韧性的影响。结果表明,当 Ni 的掺杂含量为 3.125% 时,W-Ni-Cu 合金体系的强度和硬度最好;当 Cr 的掺杂含量为 12.5% 时,合金体系的刚度最好。电子结构分析表明,Ni-3d、Co-3d、Cr-3d 和 Sn-5p 轨道的电荷密度随着合金元素掺杂率的增加而增加。合金原子的掺杂在体系中产生了新的化学键,削弱了 Cu 3d 和 W 5d 轨道之间的杂化,从而影响了 W-Cu 键的成键强度。W-X 键始终是一个强共价键,可以在一定程度上弥补 W-Cu 键的削弱。W-Cu 键和 W-X 键共同决定了体系的强度和硬度。合金原子 X 还会改变 Cu 原子 3d 和 4 s 轨道上的电子分布,导致相邻 Cu 原子间的电荷密度发生变化,从而影响材料体系的韧性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of alloying elements (Ni, Co, Cr, and Sn) on the mechanical properties of W–Cu alloy system predicted from first principles

In order to explore the reasons for the influence of alloying element X (X = Ni, Co, Cr, and Sn) on the strength, hardness and toughness of W–Cu alloy, this paper calculated the elastic constants and electronic structures of W–Cu alloy and W–X–Cu alloy based on first principles, and quantitatively evaluated the influence of alloying element X on the strength, hardness and toughness of W–Cu alloy from the atomic level. The results show that the W–Ni–Cu alloy system has the best strength and hardness when the doped content of Ni is 3.125%, and the alloy system has the best stiffness when the doped content of Cr is 12.5%. The electronic structure analysis shows that the charge density of Ni-3d, Co-3d, Cr-3d and Sn-5p orbitals increases with the increase of alloyed element doping ratio. Alloyed atom doping generates new chemical bonds in the system, and weakens the hybridization between Cu 3d and W 5d orbitals, thus affecting the bonding strength of W–Cu bonds. W–X bond is always a strong covalent bond, which can make up for the weakening of W–Cu bond to a certain extent. W–Cu bond and W–X bond jointly determine the strength and hardness of the system. Alloying atom X also changes the electron distribution on the 3d and 4 s orbitals of Cu atom, resulting in changes in the charge density between neighboring Cu atoms, which affects the toughness of the material system.

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来源期刊
Journal of Materials Science
Journal of Materials Science 工程技术-材料科学:综合
CiteScore
7.90
自引率
4.40%
发文量
1297
审稿时长
2.4 months
期刊介绍: The Journal of Materials Science publishes reviews, full-length papers, and short Communications recording original research results on, or techniques for studying the relationship between structure, properties, and uses of materials. The subjects are seen from international and interdisciplinary perspectives covering areas including metals, ceramics, glasses, polymers, electrical materials, composite materials, fibers, nanostructured materials, nanocomposites, and biological and biomedical materials. The Journal of Materials Science is now firmly established as the leading source of primary communication for scientists investigating the structure and properties of all engineering materials.
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