Reactive extrusion for efficient preparation of high temperature resistant PA6T/66/BN composites with great thermal management and mechanical properties

High temperature resistant polymer-based composite with high thermal conductivity and great mechanical properties are highly demanded in the field of electronic devices for simultaneously meeting surface mounting process and high-power operation. The key to achieving this goal is to balance the contradiction between the high melt viscosity of high-temperature resistant polymers and the dispersibility of fillers. In this work, the high-performance polyamide 6T/66/hexagonal boron nitride (PA6T/66/BN) composites were fabricated successfully via the method combining prepolymerization and reactive extrusion. Results demonstrated that this method not only significantly improves the preparation efficiency of high temperature resistant polyamide and its composites, but also enables the prepared composites to reach 3.6 W/(m⋅K), over 299 °C and 67.8 MPa in thermal conductivity, melting point and tensile strength respectively. Furthermore, the prepared composite exhibits excellent thermal management effects on LED and CPU. Therefore, the results of this work are of great significance for the efficient preparation and wide application of high-temperature resistant polymer based thermally conductive composites.