Sourav Pattanayak , Sabyasachi Panda , Rajath R. Mendon , Sanjeev Das , Archana Mallik
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引用次数: 0
摘要
本研究探讨了硫酸钠(Na2SO4)对电沉积过程中铜薄膜成核机制的影响。研究采用了伏安法和计时器法来分析电化学成核的动力学。通过 X 射线衍射对成核铜进行了相分析,同时使用扫描电子显微镜(SEM)和原子力显微镜(AFM)进行了形态和形貌研究,以进一步验证电化学研究结果。与未加入 Na2SO4 的沉积物相比,加入 Na2SO4 的沉积物更细腻、更紧密。此外,两种条件下沉积物的粗糙度也不同,有 Na2SO4 存在时形成的薄膜略微光滑。结果表明,Na2SO4 的加入改变了成核机制,从电荷转移控制转变为质量转移控制。
Na2SO4-assisted shift in the nucleation mechanism of copper-electrocrystallization from an acidic bath
In this study, the effect of sodium sulphate (Na2SO4) on the nucleation mechanism of copper films during electrodeposition was investigated. Voltammetric and chronoamperometric studies were employed to analyze the kinetics of electrochemical nucleation. Phase analysis of the nucleated copper was performed via X-ray diffraction, while morphological and topographical studies were conducted using scanning electron microscopy (SEM) and atomic force microscopy (AFM) to further validate the electrochemical findings. The deposits obtained in the presence of Na2SO4 were finer and more closely packed compared to those formed without Na2SO4. Additionally, the roughness of the deposits varied between the two conditions, with films formed in the presence of Na2SO4 being slightly smoother. The results indicate that the addition of Na2SO4 changed the nucleation mechanism from charge transfer controlled to mass transfer controlled.
期刊介绍:
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