Xiaoxing Gao , Wenzhao An , Liyu Wang , Bochuan Chen , Weiwei Xu , Qiaosheng Feng , Qilin Li , Songmei Yuan
{"title":"关于碳化硅粒子增强 Al-MMC 超声波辅助磨削过程中韧性-脆性转变临界条件的研究","authors":"Xiaoxing Gao , Wenzhao An , Liyu Wang , Bochuan Chen , Weiwei Xu , Qiaosheng Feng , Qilin Li , Songmei Yuan","doi":"10.1016/j.ceramint.2024.10.128","DOIUrl":null,"url":null,"abstract":"<div><div>High volume fraction (45 %) silicon carbide particle-reinforced aluminum matrix composites (SiC<sub>p</sub>/Al-MMCs) play a significant role in various engineering fields due to their outstanding performance. However, damages characterized by SiC particle fracture during machining lead to poor surface integrity, which severely affects the fatigue performance of SiC<sub>p</sub>/Al composite structural components. Ultrasonic-assisted grinding (UAG) is acknowledged as beneficial for promoting ductile grinding in hard and brittle materials. This study focuses on the critical conditions for ductile-brittle transition in ultrasonic-assisted grinding of SiC<sub>p</sub>/Al composites and develops a mechanism and data driven model of critical undeformed chip thickness (UCT) for ductile grinding to accurately predict the material removal mode. The model thoroughly integrates considerations of chip morphology, removal mode transition mechanism, and grinding surface damage characteristics. Response surface methodology (RSM) and genetic algorithms (GA) were utilized to correct the impact of processing parameters on the removal regime. Experiments on ultrasonic-assisted side and end grinding were conducted to thoroughly discuss the effects of different undeformed chip thicknesses, grinding speeds and ultrasonic vibration amplitude on surface damage and the critical conditions for the ductile-brittle transition. The findings corroborate the experimental data with the predicted values. Ultrasonic vibration can effectively reduce the brittle fracture of SiC particles in SiC<sub>p</sub>/Al composites. Appropriately increasing the grinding speed and reducing the chip thickness can enhance the critical chip thickness for ductile grinding and decrease the proportion of brittle surfaces, thereby achieving a balance between surface integrity and grinding efficiency. This research provides guidance for high-performance machining of SiC<sub>p</sub>/Al composites.</div></div>","PeriodicalId":267,"journal":{"name":"Ceramics International","volume":"50 24","pages":"Pages 52742-52760"},"PeriodicalIF":5.1000,"publicationDate":"2024-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Study on the critical conditions for ductile-brittle transition in ultrasonic-assisted grinding of SiC particle-reinforced Al-MMCs\",\"authors\":\"Xiaoxing Gao , Wenzhao An , Liyu Wang , Bochuan Chen , Weiwei Xu , Qiaosheng Feng , Qilin Li , Songmei Yuan\",\"doi\":\"10.1016/j.ceramint.2024.10.128\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>High volume fraction (45 %) silicon carbide particle-reinforced aluminum matrix composites (SiC<sub>p</sub>/Al-MMCs) play a significant role in various engineering fields due to their outstanding performance. However, damages characterized by SiC particle fracture during machining lead to poor surface integrity, which severely affects the fatigue performance of SiC<sub>p</sub>/Al composite structural components. Ultrasonic-assisted grinding (UAG) is acknowledged as beneficial for promoting ductile grinding in hard and brittle materials. This study focuses on the critical conditions for ductile-brittle transition in ultrasonic-assisted grinding of SiC<sub>p</sub>/Al composites and develops a mechanism and data driven model of critical undeformed chip thickness (UCT) for ductile grinding to accurately predict the material removal mode. The model thoroughly integrates considerations of chip morphology, removal mode transition mechanism, and grinding surface damage characteristics. Response surface methodology (RSM) and genetic algorithms (GA) were utilized to correct the impact of processing parameters on the removal regime. Experiments on ultrasonic-assisted side and end grinding were conducted to thoroughly discuss the effects of different undeformed chip thicknesses, grinding speeds and ultrasonic vibration amplitude on surface damage and the critical conditions for the ductile-brittle transition. The findings corroborate the experimental data with the predicted values. Ultrasonic vibration can effectively reduce the brittle fracture of SiC particles in SiC<sub>p</sub>/Al composites. Appropriately increasing the grinding speed and reducing the chip thickness can enhance the critical chip thickness for ductile grinding and decrease the proportion of brittle surfaces, thereby achieving a balance between surface integrity and grinding efficiency. This research provides guidance for high-performance machining of SiC<sub>p</sub>/Al composites.</div></div>\",\"PeriodicalId\":267,\"journal\":{\"name\":\"Ceramics International\",\"volume\":\"50 24\",\"pages\":\"Pages 52742-52760\"},\"PeriodicalIF\":5.1000,\"publicationDate\":\"2024-12-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Ceramics International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0272884224046406\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CERAMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ceramics International","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0272884224046406","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
Study on the critical conditions for ductile-brittle transition in ultrasonic-assisted grinding of SiC particle-reinforced Al-MMCs
High volume fraction (45 %) silicon carbide particle-reinforced aluminum matrix composites (SiCp/Al-MMCs) play a significant role in various engineering fields due to their outstanding performance. However, damages characterized by SiC particle fracture during machining lead to poor surface integrity, which severely affects the fatigue performance of SiCp/Al composite structural components. Ultrasonic-assisted grinding (UAG) is acknowledged as beneficial for promoting ductile grinding in hard and brittle materials. This study focuses on the critical conditions for ductile-brittle transition in ultrasonic-assisted grinding of SiCp/Al composites and develops a mechanism and data driven model of critical undeformed chip thickness (UCT) for ductile grinding to accurately predict the material removal mode. The model thoroughly integrates considerations of chip morphology, removal mode transition mechanism, and grinding surface damage characteristics. Response surface methodology (RSM) and genetic algorithms (GA) were utilized to correct the impact of processing parameters on the removal regime. Experiments on ultrasonic-assisted side and end grinding were conducted to thoroughly discuss the effects of different undeformed chip thicknesses, grinding speeds and ultrasonic vibration amplitude on surface damage and the critical conditions for the ductile-brittle transition. The findings corroborate the experimental data with the predicted values. Ultrasonic vibration can effectively reduce the brittle fracture of SiC particles in SiCp/Al composites. Appropriately increasing the grinding speed and reducing the chip thickness can enhance the critical chip thickness for ductile grinding and decrease the proportion of brittle surfaces, thereby achieving a balance between surface integrity and grinding efficiency. This research provides guidance for high-performance machining of SiCp/Al composites.
期刊介绍:
Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties.
Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour.
Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.