优化磨料浆液辅助旋转超声波加工以增强陶瓷硅片上的微通道制造 (111)

IF 5.1 2区 材料科学 Q1 MATERIALS SCIENCE, CERAMICS
Mohit Vishnoi , Siddharth Srivastava , Mamatha Theetha Gangadhar , Vikrant Singh , Vansh Malik , Anuj Bansal
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引用次数: 0

摘要

本研究考察了使用三种目数的碳化硼(B4C)粉末的研磨浆辅助旋转超声波加工(RUM)的影响:400 目、600 目和 800 目。研究了磨料粒度、进料速度和刀具旋转对材料去除率(MRR)和表面粗糙度(SR)的影响。由于磨料尺寸较大、进料速度适中、刀具旋转速度适中,400 目、进料速度 30 mm/min 和转速 1250 rpm 时的材料去除率最高,为 3.454 mm³/min;由于磨料尺寸适中、刀具转速较高,600 目、进料速度 30 mm/min 和转速 1500 rpm 时的材料去除率最低,为 0.284 mm³/min。在 800 目、15 毫米/分钟进给速度和 1500 转/分钟转速条件下,SR 最低,为 1.16 μm,这是因为磨料尺寸较小,刀具转速较高,有利于抛光和减振。在 400 目、进给速度为 45 mm/min 和转速为 1500 rpm 时,SR 值最高,为 3.71 μm,这是由于磨料尺寸较大、进给速度较高和刀具转速较高,增加了表面腐蚀。方差分析和回归分析显示,网目尺寸是对 MRR 和 SR 影响最大的参数,模型与实验值之间具有很强的相关性。研究结果表明,研磨浆辅助 RUM 适用于 X 射线、光电和半导体应用中的微通道制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of abrasive slurry assisted rotating ultrasonic machining for enhanced micro-channel fabrication on ceramic silicon wafer (111)
This study examined the impact of abrasive slurry assisted Rotating Ultrasonic Machining (RUM) using Boron Carbide (B4C) powder of three mesh sizes: 400 Mesh, 600 Mesh, and 800 Mesh. The effects of abrasive size, feed rate, and tool rotation on Material Removal Rate (MRR) and Surface Roughness (SR) were investigated. The highest MRR of 3.454 mm³/min was achieved with 400 mesh, 30 mm/min feed rate, and 1250 rpm due to larger abrasive size, medium feed rate, and medium tool rotation velocity, while the lowest MRR of 0.284 mm³/min was noted with 600 mesh, 30 mm/min feed rate, and 1500 rpm, attributed to intermediate abrasive size and high tool rotation. The lowest SR of 1.16 μm was observed at 800 mesh, 15 mm/min feed rate, and 1500 rpm, resulting from smaller abrasive size and higher tool rotation facilitating polishing action and vibrational dampening. The highest SR of 3.71 μm occurred at 400 mesh, 45 mm/min feed rate, and 1500 rpm, due to larger abrasive size, higher feed rate, and tool rotation, increasing surface corrosion. ANOVA and regression analyses highlighted mesh size as the most significant parameter for both MRR and SR, with strong model-experimental value correlations. The findings demonstrate the suitability of abrasive slurry assisted RUM for fabricating micro-channels in X-Ray, optoelectronic, and semiconductor applications.
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来源期刊
Ceramics International
Ceramics International 工程技术-材料科学:硅酸盐
CiteScore
9.40
自引率
15.40%
发文量
4558
审稿时长
25 days
期刊介绍: Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties. Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour. Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.
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