{"title":"优化磨料浆液辅助旋转超声波加工以增强陶瓷硅片上的微通道制造 (111)","authors":"Mohit Vishnoi , Siddharth Srivastava , Mamatha Theetha Gangadhar , Vikrant Singh , Vansh Malik , Anuj Bansal","doi":"10.1016/j.ceramint.2024.10.083","DOIUrl":null,"url":null,"abstract":"<div><div>This study examined the impact of abrasive slurry assisted Rotating Ultrasonic Machining (RUM) using Boron Carbide (B<sub>4</sub>C) powder of three mesh sizes: 400 Mesh, 600 Mesh, and 800 Mesh. The effects of abrasive size, feed rate, and tool rotation on Material Removal Rate (MRR) and Surface Roughness (SR) were investigated. The highest MRR of 3.454 mm³/min was achieved with 400 mesh, 30 mm/min feed rate, and 1250 rpm due to larger abrasive size, medium feed rate, and medium tool rotation velocity, while the lowest MRR of 0.284 mm³/min was noted with 600 mesh, 30 mm/min feed rate, and 1500 rpm, attributed to intermediate abrasive size and high tool rotation. The lowest SR of 1.16 μm was observed at 800 mesh, 15 mm/min feed rate, and 1500 rpm, resulting from smaller abrasive size and higher tool rotation facilitating polishing action and vibrational dampening. The highest SR of 3.71 μm occurred at 400 mesh, 45 mm/min feed rate, and 1500 rpm, due to larger abrasive size, higher feed rate, and tool rotation, increasing surface corrosion. ANOVA and regression analyses highlighted mesh size as the most significant parameter for both MRR and SR, with strong model-experimental value correlations. The findings demonstrate the suitability of abrasive slurry assisted RUM for fabricating micro-channels in X-Ray, optoelectronic, and semiconductor applications.</div></div>","PeriodicalId":267,"journal":{"name":"Ceramics International","volume":"50 24","pages":"Pages 52314-52329"},"PeriodicalIF":5.1000,"publicationDate":"2024-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optimization of abrasive slurry assisted rotating ultrasonic machining for enhanced micro-channel fabrication on ceramic silicon wafer (111)\",\"authors\":\"Mohit Vishnoi , Siddharth Srivastava , Mamatha Theetha Gangadhar , Vikrant Singh , Vansh Malik , Anuj Bansal\",\"doi\":\"10.1016/j.ceramint.2024.10.083\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This study examined the impact of abrasive slurry assisted Rotating Ultrasonic Machining (RUM) using Boron Carbide (B<sub>4</sub>C) powder of three mesh sizes: 400 Mesh, 600 Mesh, and 800 Mesh. The effects of abrasive size, feed rate, and tool rotation on Material Removal Rate (MRR) and Surface Roughness (SR) were investigated. The highest MRR of 3.454 mm³/min was achieved with 400 mesh, 30 mm/min feed rate, and 1250 rpm due to larger abrasive size, medium feed rate, and medium tool rotation velocity, while the lowest MRR of 0.284 mm³/min was noted with 600 mesh, 30 mm/min feed rate, and 1500 rpm, attributed to intermediate abrasive size and high tool rotation. The lowest SR of 1.16 μm was observed at 800 mesh, 15 mm/min feed rate, and 1500 rpm, resulting from smaller abrasive size and higher tool rotation facilitating polishing action and vibrational dampening. The highest SR of 3.71 μm occurred at 400 mesh, 45 mm/min feed rate, and 1500 rpm, due to larger abrasive size, higher feed rate, and tool rotation, increasing surface corrosion. ANOVA and regression analyses highlighted mesh size as the most significant parameter for both MRR and SR, with strong model-experimental value correlations. The findings demonstrate the suitability of abrasive slurry assisted RUM for fabricating micro-channels in X-Ray, optoelectronic, and semiconductor applications.</div></div>\",\"PeriodicalId\":267,\"journal\":{\"name\":\"Ceramics International\",\"volume\":\"50 24\",\"pages\":\"Pages 52314-52329\"},\"PeriodicalIF\":5.1000,\"publicationDate\":\"2024-12-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Ceramics International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0272884224045954\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CERAMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ceramics International","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0272884224045954","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
Optimization of abrasive slurry assisted rotating ultrasonic machining for enhanced micro-channel fabrication on ceramic silicon wafer (111)
This study examined the impact of abrasive slurry assisted Rotating Ultrasonic Machining (RUM) using Boron Carbide (B4C) powder of three mesh sizes: 400 Mesh, 600 Mesh, and 800 Mesh. The effects of abrasive size, feed rate, and tool rotation on Material Removal Rate (MRR) and Surface Roughness (SR) were investigated. The highest MRR of 3.454 mm³/min was achieved with 400 mesh, 30 mm/min feed rate, and 1250 rpm due to larger abrasive size, medium feed rate, and medium tool rotation velocity, while the lowest MRR of 0.284 mm³/min was noted with 600 mesh, 30 mm/min feed rate, and 1500 rpm, attributed to intermediate abrasive size and high tool rotation. The lowest SR of 1.16 μm was observed at 800 mesh, 15 mm/min feed rate, and 1500 rpm, resulting from smaller abrasive size and higher tool rotation facilitating polishing action and vibrational dampening. The highest SR of 3.71 μm occurred at 400 mesh, 45 mm/min feed rate, and 1500 rpm, due to larger abrasive size, higher feed rate, and tool rotation, increasing surface corrosion. ANOVA and regression analyses highlighted mesh size as the most significant parameter for both MRR and SR, with strong model-experimental value correlations. The findings demonstrate the suitability of abrasive slurry assisted RUM for fabricating micro-channels in X-Ray, optoelectronic, and semiconductor applications.
期刊介绍:
Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties.
Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour.
Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.