使用齿形法研究端面齿轮的顶部切削特征

IF 5.1 2区 工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY
Wei Sheng , Zhengminqing Li , Xiaofeng Yu
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引用次数: 0

摘要

在端面齿轮齿廓研究领域,虽然下切和尖削现象已得到广泛认可,但齿顶过切现象却经常被忽视。本文采用法向齿廓法(NTPM)构建了端面齿轮齿面的数学模型,包括工作面、圆角面和顶切面。通过齿面可视化和模拟齿轮切削,阐明了齿顶过切现象。此外,还通过有限元模拟和轮齿接触实验,将所提模型的可靠性与传统模型进行了比较。研究还分析了设计参数对过切量的影响,并提供了消除过切的倒角建议。研究结果表明,齿顶切削在具有高传动比的端面齿轮副中尤为明显,因此在设计功率分流传动系统时需要特别注意。此外,所提出的 NTPM 是检查端面齿轮齿廓特征的一种更有效的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Research on the top cutting features on face gears using normal to tooth profile method
In the field of face gear tooth profile research, while the phenomena of undercutting and pointing are widely recognized, the occurrence of tooth top overcut is often overlooked. This paper employs the Normal to Tooth Profile Method (NTPM) to construct a mathematical model for the face gear tooth surface, encompassing the working surface, fillet surface, and top cutting surface. The tooth top overcut phenomenon is elucidated by means of tooth surface visualization and simulated gear cutting. The reliability of the proposed model is also compared with traditional models through the use of finite element simulations and tooth contact experiments. The study also analyzes the influence of design parameters on the amount of overcut and provides chamfering recommendations to eliminate it. The findings reveal that tooth top cutting is particularly significant in face gear pairs with high gear ratios, necessitating special attention when designing power-split transmission systems. Furthermore, the proposed NTPM is a more effective method for examining face gear tooth profile characteristics.
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来源期刊
Engineering Science and Technology-An International Journal-Jestech
Engineering Science and Technology-An International Journal-Jestech Materials Science-Electronic, Optical and Magnetic Materials
CiteScore
11.20
自引率
3.50%
发文量
153
审稿时长
22 days
期刊介绍: Engineering Science and Technology, an International Journal (JESTECH) (formerly Technology), a peer-reviewed quarterly engineering journal, publishes both theoretical and experimental high quality papers of permanent interest, not previously published in journals, in the field of engineering and applied science which aims to promote the theory and practice of technology and engineering. In addition to peer-reviewed original research papers, the Editorial Board welcomes original research reports, state-of-the-art reviews and communications in the broadly defined field of engineering science and technology. The scope of JESTECH includes a wide spectrum of subjects including: -Electrical/Electronics and Computer Engineering (Biomedical Engineering and Instrumentation; Coding, Cryptography, and Information Protection; Communications, Networks, Mobile Computing and Distributed Systems; Compilers and Operating Systems; Computer Architecture, Parallel Processing, and Dependability; Computer Vision and Robotics; Control Theory; Electromagnetic Waves, Microwave Techniques and Antennas; Embedded Systems; Integrated Circuits, VLSI Design, Testing, and CAD; Microelectromechanical Systems; Microelectronics, and Electronic Devices and Circuits; Power, Energy and Energy Conversion Systems; Signal, Image, and Speech Processing) -Mechanical and Civil Engineering (Automotive Technologies; Biomechanics; Construction Materials; Design and Manufacturing; Dynamics and Control; Energy Generation, Utilization, Conversion, and Storage; Fluid Mechanics and Hydraulics; Heat and Mass Transfer; Micro-Nano Sciences; Renewable and Sustainable Energy Technologies; Robotics and Mechatronics; Solid Mechanics and Structure; Thermal Sciences) -Metallurgical and Materials Engineering (Advanced Materials Science; Biomaterials; Ceramic and Inorgnanic Materials; Electronic-Magnetic Materials; Energy and Environment; Materials Characterizastion; Metallurgy; Polymers and Nanocomposites)
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