George F. R. Chen, Kenny Y. K. Ong, Dawn T. H. Tan
{"title":"高速数据的芯片级色散补偿--最新进展与未来展望","authors":"George F. R. Chen, Kenny Y. K. Ong, Dawn T. H. Tan","doi":"10.1002/lpor.202400755","DOIUrl":null,"url":null,"abstract":"High-speed data movement in data center communications and telecommunications is the cornerstone of society's connectivity. It serves as a critical driver of economic activity, social networks, and education. Complementary metal-oxide semiconductor compatible silicon-based photonic integrated circuits have proliferated transceiver technology, owing to their ease of integration with application-specific integrated circuits and mass manufacturability. Fiber impairments in the transmission of high-speed data stem from both optical attenuation and optical dispersion. As data rates scale and modulation formats advance, the impact of fiber dispersion even at shorter reaches becomes more important to address. In this review article, recent advancements made in integrated, chip-scale dispersion compensation solutions are covered. The focus on chip-scale devices stems from their ability to be easily integrated within the transmitter or receiver chip of transceivers. Future perspectives on how these devices may become commonplace within transceivers and their potential impact are discussed.","PeriodicalId":204,"journal":{"name":"Laser & Photonics Reviews","volume":null,"pages":null},"PeriodicalIF":9.8000,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Chip-Scale Dispersion Compensation of High-Speed Data – Recent Progress and Future Perspectives\",\"authors\":\"George F. R. Chen, Kenny Y. K. Ong, Dawn T. H. Tan\",\"doi\":\"10.1002/lpor.202400755\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High-speed data movement in data center communications and telecommunications is the cornerstone of society's connectivity. It serves as a critical driver of economic activity, social networks, and education. Complementary metal-oxide semiconductor compatible silicon-based photonic integrated circuits have proliferated transceiver technology, owing to their ease of integration with application-specific integrated circuits and mass manufacturability. Fiber impairments in the transmission of high-speed data stem from both optical attenuation and optical dispersion. As data rates scale and modulation formats advance, the impact of fiber dispersion even at shorter reaches becomes more important to address. In this review article, recent advancements made in integrated, chip-scale dispersion compensation solutions are covered. The focus on chip-scale devices stems from their ability to be easily integrated within the transmitter or receiver chip of transceivers. Future perspectives on how these devices may become commonplace within transceivers and their potential impact are discussed.\",\"PeriodicalId\":204,\"journal\":{\"name\":\"Laser & Photonics Reviews\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":9.8000,\"publicationDate\":\"2024-10-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Laser & Photonics Reviews\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://doi.org/10.1002/lpor.202400755\",\"RegionNum\":1,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"OPTICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Laser & Photonics Reviews","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.1002/lpor.202400755","RegionNum":1,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"OPTICS","Score":null,"Total":0}
Chip-Scale Dispersion Compensation of High-Speed Data – Recent Progress and Future Perspectives
High-speed data movement in data center communications and telecommunications is the cornerstone of society's connectivity. It serves as a critical driver of economic activity, social networks, and education. Complementary metal-oxide semiconductor compatible silicon-based photonic integrated circuits have proliferated transceiver technology, owing to their ease of integration with application-specific integrated circuits and mass manufacturability. Fiber impairments in the transmission of high-speed data stem from both optical attenuation and optical dispersion. As data rates scale and modulation formats advance, the impact of fiber dispersion even at shorter reaches becomes more important to address. In this review article, recent advancements made in integrated, chip-scale dispersion compensation solutions are covered. The focus on chip-scale devices stems from their ability to be easily integrated within the transmitter or receiver chip of transceivers. Future perspectives on how these devices may become commonplace within transceivers and their potential impact are discussed.
期刊介绍:
Laser & Photonics Reviews is a reputable journal that publishes high-quality Reviews, original Research Articles, and Perspectives in the field of photonics and optics. It covers both theoretical and experimental aspects, including recent groundbreaking research, specific advancements, and innovative applications.
As evidence of its impact and recognition, Laser & Photonics Reviews boasts a remarkable 2022 Impact Factor of 11.0, according to the Journal Citation Reports from Clarivate Analytics (2023). Moreover, it holds impressive rankings in the InCites Journal Citation Reports: in 2021, it was ranked 6th out of 101 in the field of Optics, 15th out of 161 in Applied Physics, and 12th out of 69 in Condensed Matter Physics.
The journal uses the ISSN numbers 1863-8880 for print and 1863-8899 for online publications.