高灵敏度、低功耗的 CMOS 兼容型 MEMS 2D 热流传感器

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Ruining Xu;Izhar;Xiangyu Song;Linze Hong;Minghao Huang;Wei Xu
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引用次数: 0

摘要

在这封信中,我们介绍了一种与 CMOS 兼容的 MEMS 微机械和全封装二维(2D)热流传感器。传感器的设计参数由非线性一维(1D)模型决定。制造出的二维流量传感器具有一个 4 英寸厚的悬浮圆膜,并进一步封装到一个旁路外壳结构中。与最先进的传感器相比,封装后的二维流量传感器显示出更高的归一化灵敏度(50mV/(m/s)/W)和低于 7mW 的低功耗。此外,在 360° 的全范围内,输入气流为 0-30m/s 时,所开发的传感器系统的测量角度误差小于 3°,平均速度误差小于 4%。此外,该系统在所有气流速度下的响应时间均小于 11 毫秒。实验结果表明,开发的二维气流传感器有望用于智能建筑和气象监测系统中的气流测量[2024-0048]。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
CMOS-Compatible MEMS 2D Thermal Flow Sensor With High Sensitivity and Low Power Consumption
In this letter, we present a CMOS-compatible MEMS micromachined and fully packaged two-dimensional (2D) thermal flow sensor. The sensor’s design parameters are determined by a nonlinear one-dimensional (1D) model. The fabricated 2D flow sensor features a $4\mu $ m thick suspended circular membrane and is further packaged into a bypass housing structure. Compared to state-of-the-art sensors, the packaged 2D flow sensor shows a higher normalized sensitivity of 50mV/(m/s)/W and low power consumption of less than 7mW. Besides, the developed sensor system achieved a measured angle error of less than 3° and an average velocity error of less than 4% for an input airflow of 0-30m/s within the full range of 360°. It also achieved a response time of <11ms across all airflow speeds. The experimental results conclude that the developed 2D flow sensor is promising for airflow measurement in smart buildings and meteorological monitoring systems.[2024-0048]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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