Fracture strength analysis of large-size and thin photovoltaic monocrystalline silicon wafers

Diamond wire slicing technology is the main method to manufacture the substrate of the monocrystalline silicon-based solar cells. With the development of technology, the size and thickness of monocrystalline silicon wafer are respectively getting larger and thinner, which cause an increase in silicon wafer fracture probability during wafer processing and post-processing. And the change of the sawing speed, saw wire diameter and abrasive size also affect the wafer’s surface characteristics, thereby affect its fracture strength. In this paper, monocrystalline silicon wafer with large size of 210 mm × 210 mm was taken as the research object, 4-point bending test was carried out on each series of silicon wafers. The load–displacement curves during bending test were collected, and the fracture stress values were calculated by finite element method. The characteristic fracture strength and Weibull modulus of each series of silicon wafers were obtained through the statistical analysis of the data using Weibull distribution function. The effect of the silicon wafer thickness, the position of the silicon wafer in the silicon brick (usage time of the saw wire varies), and the bending test direction on the fracture characteristics was analyzed. The results showed that the increase of thickness increase the characteristic fracture strength of silicon wafer. The characteristic fracture strength of the front wafers (sawn by the fresh wire) is the smallest, while the characteristic fracture strength of the middle wafers and the rear wafers (sawn by the worn wire) are similar. The characteristic fracture strength of bending in the direction of perpendicular to the saw marks is 2–3 times that of bending in the direction of parallel to the saw marks. The reason of the difference of characteristic fracture strength was analyzed based on the surface morphology, roughness, and the saw marks of silicon wafer. In this paper, the fracture characteristics of large size monocrystalline silicon wafer are studied to provide fracture data support for industry production. The mechanism and main effect factors of silicon wafer fracture are revealed, which provides directions for improving the sawing quality and reducing the fracture probability during wafer production process and post-processing.