通过掺杂铜提高 p 型 AgSbTe2 的热电性能

IF 8.3 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Wenjie Shu, Yuxia Tang, Bingwen Su, Aijun Hong, Lin Lin, Xiaohui Zhou, Zhibo Yan, Jun-Ming Liu
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引用次数: 0

摘要

最近,p 型半导体 AgSbTe2 因其在中间温度(300-700 K)下具有良好的热电性能而受到广泛关注。然而,由于载流子浓度不理想和 Ag2Te 杂质的存在,其性能受到了限制。在此,我们合成了 AgSb1-xCuxTe2(x = 0、0.02、0.04 和 0.06),并研究了铜掺杂对 AgSbTe2 热电性能的影响。结果表明,掺杂 Cu 可抑制 Ag2Te 杂质,提高载流子浓度,从而提高功率因数 (PF)。计算显示,掺杂 Cu 会降低费米能级,减小能带隙和几个价带最大值之间的差异,从而解释了功率因数提高的原因。此外,掺杂 Cu 还降低了热导率,这可能是由于抑制了 Ag2Te 杂质和 AgSb1-xCuxTe2 的声子软化。总的来说,掺铜提高了 AgSb1-xCuxTe2 的 ZT。在所有样品中,AgSb0.96Cu0.04Te2 在 498 K 时的 ZT 最大值为 1.45,在 298 至 573 K 期间的 ZT 平均值为 1.11。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Enhanced Thermoelectric Performance of p-type AgSbTe2 via Cu Doping

Enhanced Thermoelectric Performance of p-type AgSbTe2 via Cu Doping
Recently, the p-type semiconductor AgSbTe2 has received a great deal of attention due to its promising thermoelectric performance in intermediate temperatures (300–700 K). However, its performance is limited by the suboptimal carrier concentration and the presence of Ag2Te impurities. Herein, we synthesized AgSb1–xCuxTe2 (x = 0, 0.02, 0.04, and 0.06) and investigated the effect of Cu doping on the thermoelectric properties of AgSbTe2. Our results indicate that Cu doping suppresses the Ag2Te impurities, raises the carrier concentration, and results in an improved power factor (PF). The calculation reveals that Cu doping downshifts the Fermi energy level, reduces the energy band gap and the difference among several valence band maximums, and thereby explains the improvement of PF. In addition, Cu doping reduces the thermal conductivity, possibly attributed to the inhibition of Ag2Te impurities and the phonon softening of the AgSb1–xCuxTe2. Overall, Cu doping improves the ZT of AgSb1–xCuxTe2. Among all samples, AgSb0.96Cu0.04Te2 has a maximum ZT of ∼1.45 at 498 K and an average ZT of ∼1.11 from 298 to 573 K.
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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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