用于 3D 打印巧克力的多孔淀粉-益生菌封装技术

IF 5.3 2区 农林科学 Q1 ENGINEERING, CHEMICAL
Huifang Cao , Wen Ma , Qingqing Zhu , Siyu Yao , Jinsong Feng , Dandan Li , Jianchu Chen , Jianwei Zhou , Donghong Liu , Enbo Xu
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引用次数: 0

摘要

本研究旨在利用 3D 打印技术制备益生菌含量高、活力强的功能性巧克力。首先,为了保护益生菌(L. plantarum, lpl),避免其因巧克力糖浆融化而失去活性,我们使用了不同直链淀粉/支链淀粉比例的原淀粉(直链淀粉含量最高可达 30%)来制备新型多孔载体,以封装益生菌。然后,通过扫描电镜和 BET 鉴定了多孔淀粉(HPPS1:0、3:1、1:1、1:3、0:1)形成的孔,并根据存活率和胃肠道模拟系统比较了它们封装 lpl 的能力(HPPS3:1 表现最佳)。然后将 HPPS3:1-lpl 胶囊应用于 3D 打印巧克力中,并优化了成型性能的添加水平。此外,还对益生菌细胞存活率、流变学、质地和消化模拟进行了比较。结果表明,经体外消化测试,HPPS3:1-lpl@choc(在巧克力中添加 15%的 HPPS3:1-lpl)中益生菌的存活量(107 CFU/g)远高于 lpl@choc 中的存活量(102 CFU/g,无微胶囊保护),其中 HPPS3:1-lpl@choc15 的塑形性能最佳。这项研究为利用多孔淀粉载体封装益生菌,实现巧克力(或其他类似食品材料)个性化设计的熔融 3D 打印提供了一种新的替代策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Porous starch-probiotics encapsulation for 3D-printed chocolate
This study aims to utilize 3D printing technology to prepare functional chocolates with high content and viability of probiotics. Firstly, in order to protect probiotics (L. plantarum, lpl) avoiding inactive by melting chocolate syrup, we used raw starches as different amylose/amylopectin ratios (up to ∼30% amylose) for preparing novel porous carriers to encapsulate them. Then the formed pores of porous starches (HPPS1:0, 3:1, 1:1, 1:3, 0:1) were identified by SEM and BET, and their ability to encapsulate lpl were compared (with HPPS3:1 showing the best behavior) based on the survival rate and gastrointestinal simulation system. Then HPPS3:1-lpl capsule was applied in 3D printed chocolate, with optimization of adding levels for the shaping property. Probiotic cell viability, rheology, texture, and digestion simulation were also compared. The results showed that the surviving amount of probiotics (107 CFU/g) in HPPS3:1-lpl@choc (add 15% HPPS3:1-lpl to the chocolate) was much higher than that in lpl@choc (102 CFU/g, without microencapsulation protection) after in-vitro digestion test, among which HPPS3:1-lpl@choc15 had the best shaping property. This research provides a new alternative strategy for utilizing porous starch carrier to encapsulate probiotics for melting 3D printing of chocolate (or other similar food materials) as personalized design.
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来源期刊
Journal of Food Engineering
Journal of Food Engineering 工程技术-工程:化工
CiteScore
11.80
自引率
5.50%
发文量
275
审稿时长
24 days
期刊介绍: The journal publishes original research and review papers on any subject at the interface between food and engineering, particularly those of relevance to industry, including: Engineering properties of foods, food physics and physical chemistry; processing, measurement, control, packaging, storage and distribution; engineering aspects of the design and production of novel foods and of food service and catering; design and operation of food processes, plant and equipment; economics of food engineering, including the economics of alternative processes. Accounts of food engineering achievements are of particular value.
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