利用 GPU 对内存修复进行有效的并行冗余分析

IF 2.8 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Seung Ho Shin;Hayoung Lee;Sungho Kang
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引用次数: 0

摘要

存储密度的快速增加导致存储单元中故障发生的增加。为了提高自动测试设备的记忆成品率,研究了有效的记忆测试和维修方法。多个存储芯片同时测试,以提高吞吐量和降低成本。通常,冗余分析(RA)用于内存修复。然而,由于传统的RA方法将故障信息存储在各自的故障位图中,并按顺序进行操作,因此由于面积大、分析时间长,存在一定的局限性。针对这些问题,提出了一种基于图形处理单元(GPU)的RA方法,该方法显著提高了多存储器修复解的搜索效率。提出的RA方法策略性地聚焦于支点线,有效地利用并行处理,减小了解的搜索空间。此外,所提出的方法不需要大量使用故障位图,因为所有过程都是在GPU上进行的。该过程包括在内存测试过程中实时的故障收集、分析、空闲分配和动态的解决方案决策过程。实验结果表明,该方法对多记忆体具有最佳修复率和较高的分析速度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effective Parallel Redundancy Analysis Using GPU for Memory Repair
The rapid increment of the memory density leads to an increment of fault occurrence in memory cells. To improve the memory yield, effective memory test and repair methodologies for automatic test equipment (ATE) have been studied. Multiple memory chips are tested simultaneously by the ATE to improve throughput and reduce costs. In general, redundancy analysis (RA) is used for memory repair. However, since conventional RA methods store fault information in the respective failure bitmaps and operate sequentially, those have limitations due to the high area and analysis time. To address these problems, a novel graphic processing unit (GPU)-based RA method has been proposed which significantly enhances the efficiency of searching for repair solutions for multiple memories. The proposed RA method strategically focuses on the pivot line to efficiently utilize parallel processing and reduce the solution search space. Moreover, the proposed method does not require the extensive use of failure bitmaps since all process is conducted on the GPU. The process involves real-time fault collection, analysis, spare allocation, and solution decision process dynamically during the memory test. Experimental results demonstrate that the performance of the proposed RA method achieves an optimal repair rate and high analysis speed for multiple memories.
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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