氮化硼纳米片与二维微米银片协同增强环氧树脂复合材料的导热性和绝缘性

IF 2.7 3区 化学 Q2 POLYMER SCIENCE
Wenchao Zhang, Yutong Xiao, Yuan Liang, Qingguo Chen, Dong Yue, Yu Feng
{"title":"氮化硼纳米片与二维微米银片协同增强环氧树脂复合材料的导热性和绝缘性","authors":"Wenchao Zhang, Yutong Xiao, Yuan Liang, Qingguo Chen, Dong Yue, Yu Feng","doi":"10.1002/app.56293","DOIUrl":null,"url":null,"abstract":"With the rapid progress of the advanced electronic device industry, precision electronic instruments are gradually developing towards miniaturization. In this case, epoxy resin gradually attracts people's attention, but its intrinsic thermal conductivity is not high, and the resulting heat dissipation problem limits the further application of epoxy resin in the field of electronic packaging. Therefore, how to enhance the thermal conductivity of epoxy resins has become an urgent problem in the field of electronic packaging. In this work, BNNS was successfully prepared by stripping h‐BN into a flaky two‐dimensional material, which was added to the epoxy resin as a filler to make the composite material. And on the basis of the above, two‐dimensional micron silver flakes (AgMS) with different mass fractions were added to the composites, and the AgMS/BNNS/EP composites were successfully prepared. When BNNS was 25 wt% and AgMS was 1 wt%, its out‐of‐plane thermal conductivity was enhanced from 0.17 W m<jats:sup>−1</jats:sup> K<jats:sup>−1</jats:sup> of pure epoxy resin to 0.43 W m<jats:sup>−1</jats:sup> K<jats:sup>−1</jats:sup>. When BNNS was 20 wt% and AgMS was 1 wt%, the breakdown strength was enhanced from 105 kV/mm for pure epoxy to 130 kV/mm. This work provides a new strategy for synthesizing high‐thermal‐conductivity epoxy matrix composites.","PeriodicalId":183,"journal":{"name":"Journal of Applied Polymer Science","volume":null,"pages":null},"PeriodicalIF":2.7000,"publicationDate":"2024-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Boron nitride nanosheets synergized with two‐dimensional micron silver sheets to enhance thermal conductivity and insulation of epoxy resin composites\",\"authors\":\"Wenchao Zhang, Yutong Xiao, Yuan Liang, Qingguo Chen, Dong Yue, Yu Feng\",\"doi\":\"10.1002/app.56293\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the rapid progress of the advanced electronic device industry, precision electronic instruments are gradually developing towards miniaturization. In this case, epoxy resin gradually attracts people's attention, but its intrinsic thermal conductivity is not high, and the resulting heat dissipation problem limits the further application of epoxy resin in the field of electronic packaging. Therefore, how to enhance the thermal conductivity of epoxy resins has become an urgent problem in the field of electronic packaging. In this work, BNNS was successfully prepared by stripping h‐BN into a flaky two‐dimensional material, which was added to the epoxy resin as a filler to make the composite material. And on the basis of the above, two‐dimensional micron silver flakes (AgMS) with different mass fractions were added to the composites, and the AgMS/BNNS/EP composites were successfully prepared. When BNNS was 25 wt% and AgMS was 1 wt%, its out‐of‐plane thermal conductivity was enhanced from 0.17 W m<jats:sup>−1</jats:sup> K<jats:sup>−1</jats:sup> of pure epoxy resin to 0.43 W m<jats:sup>−1</jats:sup> K<jats:sup>−1</jats:sup>. When BNNS was 20 wt% and AgMS was 1 wt%, the breakdown strength was enhanced from 105 kV/mm for pure epoxy to 130 kV/mm. This work provides a new strategy for synthesizing high‐thermal‐conductivity epoxy matrix composites.\",\"PeriodicalId\":183,\"journal\":{\"name\":\"Journal of Applied Polymer Science\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.7000,\"publicationDate\":\"2024-09-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Applied Polymer Science\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://doi.org/10.1002/app.56293\",\"RegionNum\":3,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"POLYMER SCIENCE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Applied Polymer Science","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.1002/app.56293","RegionNum":3,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0

摘要

随着先进电子设备产业的飞速发展,精密电子仪器逐渐向小型化方向发展。在这种情况下,环氧树脂逐渐受到人们的关注,但其固有的导热系数并不高,由此带来的散热问题限制了环氧树脂在电子封装领域的进一步应用。因此,如何提高环氧树脂的导热性已成为电子封装领域亟待解决的问题。在这项工作中,通过将 h-BN 剥离成片状二维材料,成功制备出了 BNNS,并将其作为填料添加到环氧树脂中制成了复合材料。在此基础上,在复合材料中加入不同质量分数的二维微米银薄片(AgMS),成功制备出 AgMS/BNNS/EP 复合材料。当 BNNS 为 25 wt%、AgMS 为 1 wt% 时,其平面外热导率从纯环氧树脂的 0.17 W m-1 K-1 提高到 0.43 W m-1 K-1。当 BNNS 为 20 wt%、AgMS 为 1 wt% 时,击穿强度从纯环氧树脂的 105 kV/mm 提高到 130 kV/mm。这项研究为合成高导热环氧基复合材料提供了一种新策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Boron nitride nanosheets synergized with two‐dimensional micron silver sheets to enhance thermal conductivity and insulation of epoxy resin composites

Boron nitride nanosheets synergized with two‐dimensional micron silver sheets to enhance thermal conductivity and insulation of epoxy resin composites
With the rapid progress of the advanced electronic device industry, precision electronic instruments are gradually developing towards miniaturization. In this case, epoxy resin gradually attracts people's attention, but its intrinsic thermal conductivity is not high, and the resulting heat dissipation problem limits the further application of epoxy resin in the field of electronic packaging. Therefore, how to enhance the thermal conductivity of epoxy resins has become an urgent problem in the field of electronic packaging. In this work, BNNS was successfully prepared by stripping h‐BN into a flaky two‐dimensional material, which was added to the epoxy resin as a filler to make the composite material. And on the basis of the above, two‐dimensional micron silver flakes (AgMS) with different mass fractions were added to the composites, and the AgMS/BNNS/EP composites were successfully prepared. When BNNS was 25 wt% and AgMS was 1 wt%, its out‐of‐plane thermal conductivity was enhanced from 0.17 W m−1 K−1 of pure epoxy resin to 0.43 W m−1 K−1. When BNNS was 20 wt% and AgMS was 1 wt%, the breakdown strength was enhanced from 105 kV/mm for pure epoxy to 130 kV/mm. This work provides a new strategy for synthesizing high‐thermal‐conductivity epoxy matrix composites.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Applied Polymer Science
Journal of Applied Polymer Science 化学-高分子科学
CiteScore
5.70
自引率
10.00%
发文量
1280
审稿时长
2.7 months
期刊介绍: The Journal of Applied Polymer Science is the largest peer-reviewed publication in polymers, #3 by total citations, and features results with real-world impact on membranes, polysaccharides, and much more.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信