构建用于氢气进化反应的掺硫镍铜界面

IF 9.6 1区化学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

ACS Materials Letters Pub Date : 2024-09-18 DOI:10.1021/acsmaterialslett.4c01339

Jiajie Yu, Shiwen Zhang, Yuyang Liu, Yurun Tong, Yijie Zhong, Bin He, Enlai Hu, Jing Zhang, Zhongwei Chen

{"title":"构建用于氢气进化反应的掺硫镍铜界面","authors":"Jiajie Yu, Shiwen Zhang, Yuyang Liu, Yurun Tong, Yijie Zhong, Bin He, Enlai Hu, Jing Zhang, Zhongwei Chen","doi":"10.1021/acsmaterialslett.4c01339","DOIUrl":null,"url":null,"abstract":"Developing efficient and economical electrocatalysts for the hydrogen evolution reaction (HER) is important for high-purity hydrogen generation. Transition metals-based compounds have been considered as promising substitutes for the Pt-based electrocatalysts toward HER. Nevertheless, pure metals display inert HER activity because of their unfavorable adsorption behavior for intermediates. Herein, thiourea engaged electrodeposition was conducted to fabricate sulfur-doped nickel and copper (S–Ni/Cu) nanowires that contain numerous interfaces. Interface and sulfur doping redistributed the electronic states of the electrocatalyst structure, which accelerated the adsorption of hydrogen atoms at active sites and promoted the water dissociation process. Consequently, the HER overpotential of S–Ni/Cu is only 67 mV at 10 mA cm<sup>–2</sup>, with excellent durability.","PeriodicalId":19,"journal":{"name":"ACS Materials Letters","volume":"29 1","pages":""},"PeriodicalIF":9.6000,"publicationDate":"2024-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Construction of Sulfur Doped Nickel and Copper Interfaces for Hydrogen Evolution Reaction\",\"authors\":\"Jiajie Yu, Shiwen Zhang, Yuyang Liu, Yurun Tong, Yijie Zhong, Bin He, Enlai Hu, Jing Zhang, Zhongwei Chen\",\"doi\":\"10.1021/acsmaterialslett.4c01339\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Developing efficient and economical electrocatalysts for the hydrogen evolution reaction (HER) is important for high-purity hydrogen generation. Transition metals-based compounds have been considered as promising substitutes for the Pt-based electrocatalysts toward HER. Nevertheless, pure metals display inert HER activity because of their unfavorable adsorption behavior for intermediates. Herein, thiourea engaged electrodeposition was conducted to fabricate sulfur-doped nickel and copper (S–Ni/Cu) nanowires that contain numerous interfaces. Interface and sulfur doping redistributed the electronic states of the electrocatalyst structure, which accelerated the adsorption of hydrogen atoms at active sites and promoted the water dissociation process. Consequently, the HER overpotential of S–Ni/Cu is only 67 mV at 10 mA cm<sup>–2</sup>, with excellent durability.\",\"PeriodicalId\":19,\"journal\":{\"name\":\"ACS Materials Letters\",\"volume\":\"29 1\",\"pages\":\"\"},\"PeriodicalIF\":9.6000,\"publicationDate\":\"2024-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Materials Letters\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://doi.org/10.1021/acsmaterialslett.4c01339\",\"RegionNum\":1,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Materials Letters","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.1021/acsmaterialslett.4c01339","RegionNum":1,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

摘要

开发高效、经济的氢进化反应（HER）电催化剂对于高纯度制氢非常重要。过渡金属基化合物一直被认为是氢进化反应铂基电催化剂的理想替代品。然而，由于纯金属对中间产物的吸附行为不理想，因此其 HER 活性不强。在此，我们采用硫脲参与电沉积的方法，制备了含有大量界面的硫掺杂镍和铜（S-Ni/Cu）纳米线。界面和硫掺杂重新分配了电催化剂结构的电子态，从而加速了氢原子在活性位点的吸附并促进了水的解离过程。因此，在 10 mA cm-2 的条件下，S-Ni/Cu 的 HER 过电位仅为 67 mV，具有极佳的耐久性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Construction of Sulfur Doped Nickel and Copper Interfaces for Hydrogen Evolution Reaction

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Construction of Sulfur Doped Nickel and Copper Interfaces for Hydrogen Evolution Reaction

Developing efficient and economical electrocatalysts for the hydrogen evolution reaction (HER) is important for high-purity hydrogen generation. Transition metals-based compounds have been considered as promising substitutes for the Pt-based electrocatalysts toward HER. Nevertheless, pure metals display inert HER activity because of their unfavorable adsorption behavior for intermediates. Herein, thiourea engaged electrodeposition was conducted to fabricate sulfur-doped nickel and copper (S–Ni/Cu) nanowires that contain numerous interfaces. Interface and sulfur doping redistributed the electronic states of the electrocatalyst structure, which accelerated the adsorption of hydrogen atoms at active sites and promoted the water dissociation process. Consequently, the HER overpotential of S–Ni/Cu is only 67 mV at 10 mA cm^–2, with excellent durability.

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来源期刊

ACS Materials Letters MATERIALS SCIENCE, MULTIDISCIPLINARY-

CiteScore

14.60

自引率

3.50%

发文量

261

期刊介绍： ACS Materials Letters is a journal that publishes high-quality and urgent papers at the forefront of fundamental and applied research in the field of materials science. It aims to bridge the gap between materials and other disciplines such as chemistry, engineering, and biology. The journal encourages multidisciplinary and innovative research that addresses global challenges. Papers submitted to ACS Materials Letters should clearly demonstrate the need for rapid disclosure of key results. The journal is interested in various areas including the design, synthesis, characterization, and evaluation of emerging materials, understanding the relationships between structure, property, and performance, as well as developing materials for applications in energy, environment, biomedical, electronics, and catalysis. The journal has a 2-year impact factor of 11.4 and is dedicated to publishing transformative materials research with fast processing times. The editors and staff of ACS Materials Letters actively participate in major scientific conferences and engage closely with readers and authors. The journal also maintains an active presence on social media to provide authors with greater visibility.