多态柔电结构在单一和多重失效模式下输出电气响应性能的可靠性分析

IF 1.5 4区物理与天体物理 Q3 PHYSICS, APPLIED

Japanese Journal of Applied Physics Pub Date : 2024-09-16 DOI:10.35848/1347-4065/ad7004

Xiao-Xiao Liu, Yang-Bing Xu, Cheng Han and Feng Zhang

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引用次数: 0

摘要

本文提出了挠性电动梁在电气开路和短路状态下的可靠性模型，分别考虑了不同失效模式和输出电气响应性能的多种失效模式。根据输出电气响应模型，可定义柔性电动横梁在两种电路状态下的可靠性指数。依次分别采用重要度抽样法（IS）和混合重要度抽样法（IS）计算挠性梁在单一失效模式和多重失效模式下的可靠性。通过将挠性梁的可靠性结果与蒙特卡罗模拟（MCS）的结果进行比较，对挠性梁的可靠性结果进行了验证。数值结果表明，当开路电压临界值为 0.235 V，挠性梁厚度为 1 mm，长厚比为 20 时，挠性梁进入相对安全可靠的状态。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Reliability analysis of output electrical response performance of multi-state flexoelectric structures under single and multiple failure modes

This paper proposes a reliability model of flexoelectric beams in the electrical open and short circuit states when different failure modes and the multiple failure modes of the output electrical response performances are considered, respectively. The reliability indices of the flexoelectric beams in the two circuit states can be defined based on the output electrical response models. Sequentially, the importance sampling (IS) and the mixed importance sampling (IS) methods are respectively used to calculate the reliability of the flexoelectric beams in single and multiple failure modes. The reliability results of the flexoelectric beams are verified by comparing them with the results of the Monte Carlo Simulation (MCS). The numerical results show that the flexoelectric beam is entered into a relatively safe and reliable state when the critical value of the open circuit voltage of 0.235 V and the thickness of the flexoelectric beams of 1 mm are considered as well as the length-thickness ratio of 20.

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来源期刊

Japanese Journal of Applied Physics 物理-物理：应用

CiteScore

3.00

自引率

26.70%

发文量

818

审稿时长

3.5 months

期刊介绍： The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP). JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields: • Semiconductors, dielectrics, and organic materials • Photonics, quantum electronics, optics, and spectroscopy • Spintronics, superconductivity, and strongly correlated materials • Device physics including quantum information processing • Physics-based circuits and systems • Nanoscale science and technology • Crystal growth, surfaces, interfaces, thin films, and bulk materials • Plasmas, applied atomic and molecular physics, and applied nuclear physics • Device processing, fabrication and measurement technologies, and instrumentation • Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS