Xindi Yao, Peng Lian, Jinping Chen, Yi Zeng, Tianjun Yu, Shuangqing Wang, Xudong Guo, Rui Hu, Peng Tian, Michaela Vockenhuber, Dimitrios Kazazis, Yasin Ekinci, Guoqiang Yang and Yi Li
{"title":"碘功能化聚苯乙烯作为电子束和极紫外光刻技术的非化学放大抗蚀剂†。","authors":"Xindi Yao, Peng Lian, Jinping Chen, Yi Zeng, Tianjun Yu, Shuangqing Wang, Xudong Guo, Rui Hu, Peng Tian, Michaela Vockenhuber, Dimitrios Kazazis, Yasin Ekinci, Guoqiang Yang and Yi Li","doi":"10.1039/D4LP00136B","DOIUrl":null,"url":null,"abstract":"<p >A novel non-chemically amplified resist (n-CAR) based on biphenyl iodonium perfluoro-1-butanesulfonate-modified polystyrene with a naphthalimide scaffold (PSNA<small><sub>0.4</sub></small>) was synthesized and characterized. Through extensive exploration using dose-dependent resist thickness analysis, acetonitrile was identified as the optimal developer. Employing electron beam lithography (EBL), the n-CAR of PSNA<small><sub>0.4</sub></small> demonstrated its high-resolution patterning capability by resolving a dense line pattern of 18 nm L/S at an exposure dose of 1300 μC cm<small><sup>−2</sup></small>, achieving a high contrast of 7.1. Further studies using extreme ultraviolet lithography (EUVL) demonstrated that the PSNA<small><sub>0.4</sub></small> resist can achieve 22 nm L/S patterns at a dose of 90.8 mJ cm<small><sup>−2</sup></small>, underscoring its high sensitivity for n-CARs. Detailed studies to gain insights into the underlying patterning mechanisms using X-ray photoelectron spectroscopy (XPS) suggest that the cleavage of polar iodonium into nonpolar polystyrene (PS)-based iodobenzene species enables a solubility switch, resulting in negative lithographic patterns. These findings highlight the innovative potential of the PSNA<small><sub>0.4</sub></small> resist in advancing the capabilities of n-CAR technologies, particularly in the realms of EBL and EUVL, for high-resolution lithographic applications.</p>","PeriodicalId":101139,"journal":{"name":"RSC Applied Polymers","volume":" 5","pages":" 870-879"},"PeriodicalIF":0.0000,"publicationDate":"2024-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://pubs.rsc.org/en/content/articlepdf/2024/lp/d4lp00136b?page=search","citationCount":"0","resultStr":"{\"title\":\"Iodonium functionalized polystyrene as non-chemically amplified resists for electron beam and extreme ultraviolet lithography†\",\"authors\":\"Xindi Yao, Peng Lian, Jinping Chen, Yi Zeng, Tianjun Yu, Shuangqing Wang, Xudong Guo, Rui Hu, Peng Tian, Michaela Vockenhuber, Dimitrios Kazazis, Yasin Ekinci, Guoqiang Yang and Yi Li\",\"doi\":\"10.1039/D4LP00136B\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p >A novel non-chemically amplified resist (n-CAR) based on biphenyl iodonium perfluoro-1-butanesulfonate-modified polystyrene with a naphthalimide scaffold (PSNA<small><sub>0.4</sub></small>) was synthesized and characterized. Through extensive exploration using dose-dependent resist thickness analysis, acetonitrile was identified as the optimal developer. Employing electron beam lithography (EBL), the n-CAR of PSNA<small><sub>0.4</sub></small> demonstrated its high-resolution patterning capability by resolving a dense line pattern of 18 nm L/S at an exposure dose of 1300 μC cm<small><sup>−2</sup></small>, achieving a high contrast of 7.1. Further studies using extreme ultraviolet lithography (EUVL) demonstrated that the PSNA<small><sub>0.4</sub></small> resist can achieve 22 nm L/S patterns at a dose of 90.8 mJ cm<small><sup>−2</sup></small>, underscoring its high sensitivity for n-CARs. Detailed studies to gain insights into the underlying patterning mechanisms using X-ray photoelectron spectroscopy (XPS) suggest that the cleavage of polar iodonium into nonpolar polystyrene (PS)-based iodobenzene species enables a solubility switch, resulting in negative lithographic patterns. 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Iodonium functionalized polystyrene as non-chemically amplified resists for electron beam and extreme ultraviolet lithography†
A novel non-chemically amplified resist (n-CAR) based on biphenyl iodonium perfluoro-1-butanesulfonate-modified polystyrene with a naphthalimide scaffold (PSNA0.4) was synthesized and characterized. Through extensive exploration using dose-dependent resist thickness analysis, acetonitrile was identified as the optimal developer. Employing electron beam lithography (EBL), the n-CAR of PSNA0.4 demonstrated its high-resolution patterning capability by resolving a dense line pattern of 18 nm L/S at an exposure dose of 1300 μC cm−2, achieving a high contrast of 7.1. Further studies using extreme ultraviolet lithography (EUVL) demonstrated that the PSNA0.4 resist can achieve 22 nm L/S patterns at a dose of 90.8 mJ cm−2, underscoring its high sensitivity for n-CARs. Detailed studies to gain insights into the underlying patterning mechanisms using X-ray photoelectron spectroscopy (XPS) suggest that the cleavage of polar iodonium into nonpolar polystyrene (PS)-based iodobenzene species enables a solubility switch, resulting in negative lithographic patterns. These findings highlight the innovative potential of the PSNA0.4 resist in advancing the capabilities of n-CAR technologies, particularly in the realms of EBL and EUVL, for high-resolution lithographic applications.