Til Hillebrecht, Morten Schierholz, Youcef Hassab, Johannes Alfert, Christian Schuster
{"title":"通过阵列和链路分析生成和应用超大型信号完整性数据集","authors":"Til Hillebrecht, Morten Schierholz, Youcef Hassab, Johannes Alfert, Christian Schuster","doi":"10.1109/temc.2024.3450307","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"65 1","pages":""},"PeriodicalIF":2.0000,"publicationDate":"2024-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Generation and Application of a Very Large Dataset for Signal Integrity Via Array and Link Analysis\",\"authors\":\"Til Hillebrecht, Morten Schierholz, Youcef Hassab, Johannes Alfert, Christian Schuster\",\"doi\":\"10.1109/temc.2024.3450307\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":55012,\"journal\":{\"name\":\"IEEE Transactions on Electromagnetic Compatibility\",\"volume\":\"65 1\",\"pages\":\"\"},\"PeriodicalIF\":2.0000,\"publicationDate\":\"2024-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electromagnetic Compatibility\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://doi.org/10.1109/temc.2024.3450307\",\"RegionNum\":3,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://doi.org/10.1109/temc.2024.3450307","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.