利用玻璃基 IPD 技术实现超宽截止带和高选择性的微型带通滤波器

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Jianye Wang, Yazi Cao, Wei Wu, Gaofeng Wang
{"title":"利用玻璃基 IPD 技术实现超宽截止带和高选择性的微型带通滤波器","authors":"Jianye Wang,&nbsp;Yazi Cao,&nbsp;Wei Wu,&nbsp;Gaofeng Wang","doi":"10.1016/j.mejo.2024.106402","DOIUrl":null,"url":null,"abstract":"<div><p>A miniaturized bandpass filter (BPF) with ultrawide-stopband and high selectivity performance is proposed by virtue of glass-based integrated passive devices (IPD) technology. The proposed BPF consists of two modified second-order units and an impedance inverter. In the modified second-order units, two capacitors are added to the traditional second-order Chebyshev bandpass filter, which can generate two additional transmission zeros locating in the lower and upper bands, respectively. Moreover, these two modified second-order units are cascaded to improve the selectivity and achieve the ultrawide-stopband of the proposed BPF. In addition, the cascaded impedance inverter is introduced to further improve impedance matching of the proposed BPF. The proposed BPF is fabricated using glass-based IPD technology and measured by on-wafer probing. The fabricated BPF has a compact size of 1.0 mm × 1.0 mm × 0.35 mm. The measured results show that the fabricated BPF can cover the wide operating band from 3.3 GHz to 5.0 GHz with an insertion loss of 1.4 dB, a return loss better than 17.5 dB in the passband, and an upper stopband suppression better than 21.6 dB up to 43.5 GHz (10.48<em>f</em><sub>0</sub>). In addition, the fabricated BPF can achieve a good frequency selectivity with a rectangular coefficient of 1.33. The simulated and measured results exhibit good agreements.</p></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Miniaturized bandpass filter with ultrawide-stopband and high selectivity using glass-based IPD technology\",\"authors\":\"Jianye Wang,&nbsp;Yazi Cao,&nbsp;Wei Wu,&nbsp;Gaofeng Wang\",\"doi\":\"10.1016/j.mejo.2024.106402\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>A miniaturized bandpass filter (BPF) with ultrawide-stopband and high selectivity performance is proposed by virtue of glass-based integrated passive devices (IPD) technology. The proposed BPF consists of two modified second-order units and an impedance inverter. In the modified second-order units, two capacitors are added to the traditional second-order Chebyshev bandpass filter, which can generate two additional transmission zeros locating in the lower and upper bands, respectively. Moreover, these two modified second-order units are cascaded to improve the selectivity and achieve the ultrawide-stopband of the proposed BPF. In addition, the cascaded impedance inverter is introduced to further improve impedance matching of the proposed BPF. The proposed BPF is fabricated using glass-based IPD technology and measured by on-wafer probing. The fabricated BPF has a compact size of 1.0 mm × 1.0 mm × 0.35 mm. The measured results show that the fabricated BPF can cover the wide operating band from 3.3 GHz to 5.0 GHz with an insertion loss of 1.4 dB, a return loss better than 17.5 dB in the passband, and an upper stopband suppression better than 21.6 dB up to 43.5 GHz (10.48<em>f</em><sub>0</sub>). In addition, the fabricated BPF can achieve a good frequency selectivity with a rectangular coefficient of 1.33. The simulated and measured results exhibit good agreements.</p></div>\",\"PeriodicalId\":49818,\"journal\":{\"name\":\"Microelectronics Journal\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2024-09-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Journal\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1879239124001061\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239124001061","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

利用玻璃基集成无源器件(IPD)技术,提出了一种具有超宽截止带和高选择性的小型带通滤波器(BPF)。拟议的 BPF 由两个改进的二阶单元和一个阻抗反相器组成。在改进的二阶单元中,传统的二阶切比雪夫带通滤波器增加了两个电容器,可分别在低频带和高频带产生两个额外的传输零点。此外,这两个改进的二阶单元被级联起来,以提高选择性,实现拟议 BPF 的超宽截止带。此外,还引入了级联阻抗变换器,以进一步改善拟议 BPF 的阻抗匹配。所提出的 BPF 采用玻璃基 IPD 技术制造,并通过晶圆探测进行测量。制作的 BPF 外形小巧,尺寸为 1.0 mm × 1.0 mm × 0.35 mm。测量结果表明,所制作的 BPF 可以覆盖 3.3 GHz 至 5.0 GHz 的宽工作频带,插入损耗为 1.4 dB,通带回波损耗优于 17.5 dB,上阻带抑制优于 21.6 dB,最高可达 43.5 GHz (10.48f0)。此外,制作的 BPF 还具有良好的频率选择性,矩形系数为 1.33。模拟和测量结果显示出良好的一致性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Miniaturized bandpass filter with ultrawide-stopband and high selectivity using glass-based IPD technology

A miniaturized bandpass filter (BPF) with ultrawide-stopband and high selectivity performance is proposed by virtue of glass-based integrated passive devices (IPD) technology. The proposed BPF consists of two modified second-order units and an impedance inverter. In the modified second-order units, two capacitors are added to the traditional second-order Chebyshev bandpass filter, which can generate two additional transmission zeros locating in the lower and upper bands, respectively. Moreover, these two modified second-order units are cascaded to improve the selectivity and achieve the ultrawide-stopband of the proposed BPF. In addition, the cascaded impedance inverter is introduced to further improve impedance matching of the proposed BPF. The proposed BPF is fabricated using glass-based IPD technology and measured by on-wafer probing. The fabricated BPF has a compact size of 1.0 mm × 1.0 mm × 0.35 mm. The measured results show that the fabricated BPF can cover the wide operating band from 3.3 GHz to 5.0 GHz with an insertion loss of 1.4 dB, a return loss better than 17.5 dB in the passband, and an upper stopband suppression better than 21.6 dB up to 43.5 GHz (10.48f0). In addition, the fabricated BPF can achieve a good frequency selectivity with a rectangular coefficient of 1.33. The simulated and measured results exhibit good agreements.

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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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