基于 0.075 mm2 BJT 的温度传感器,在 -40 °C 至 120 °C 范围内的单点微调 3σ 误差为 ±0.97 °C

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Xinquan Lai, Zhiwen Niu, Bingyuan Wang, Linxi Li
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引用次数: 0

摘要

本文介绍了一种基于双极结晶体管 (BJT) 的 CMOS 温度传感器,具有精度高、面积小和功耗低的特点。本文提出了一种带有偏置 NPN 晶体管的反馈放大器的结构,并结合了动态元件匹配 (DEM),以避免在深亚微米工艺中因衬底 PNP 晶体管的有限电流增益而产生的误差影响。此外,开关电容(SC)积分器采用两个单级级联放大器进行交替循环采样和积分,有效简化了电路设计并降低了工作电压。所提出的传感器采用标准 180 纳米 CMOS 工艺制造,有效芯片面积为 0.075 平方毫米。测量结果表明,经过单点温度校准后,传感器在 -40 °C 至 120 °C 的温度范围内的误差为 ±0.97 °C (3σ)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 0.075 mm2 BJT-based temperature sensor with a one-point trimmed 3σ inaccuracy of ±0.97 °C from −40 °C to 120 °C

This paper presents a bipolar junction transistor (BJT)-based CMOS temperature sensor for high accuracy, small-scale area, and low power consumption. A structure with a feedback amplifier biasing NPN transistors, combined with dynamic element matching (DEM), is proposed to avoid the effects of errors arising from the limited current gain of substrate PNP transistors in deep-submicron processes. Moreover, the switched capacitor (SC) integrators employ two single-stage cascode amplifiers for alternating cyclic sampling and integration, effectively simplifying the circuit design and reducing the operating voltage. The proposed sensor is fabricated with a standard 180 nm CMOS process, occupying an active chip area of 0.075 mm2. It consumes 39.1 μW of power at room temperature, operating with a supply voltage of 1.8 V. The measurements indicate that the sensor exhibits an inaccuracy of ±0.97 °C (3σ) across the temperature range from −40 °C to 120 °C following a single-point temperature calibration.

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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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