{"title":"Y 对 Cu-Zr-Mg-Y 合金微观结构和物理性质的影响","authors":"","doi":"10.1016/j.vacuum.2024.113651","DOIUrl":null,"url":null,"abstract":"<div><p>This work presents the development of two novel Cu-Zr-Mg(Y) alloys. The alloys were prepared using vacuum melting and show good conductivity and mechanical properties after solution treatment+60 % cold rolling + aging at 450 °C for 60 min.</p><p>The measurement results reveal that the Cu-Zr-Mg alloy has a microhardness of 165 ± 5 HV, an electrical conductivity of 68.5 ± 0.2 % IACS and a tensile strength of 483 ± 15 MPa while the Cu-Zr-Mg-Y alloy has a microhardness of 172 ± 6 HV, an electrical conductivity of 67.9 ± 0.2 % IACS and a tensile strength of 503 ± 12 MPa.</p><p>The addition of Y promotes the recovery and recrystallization of the alloys and causes the refinement of the grain size. The appearance of copper texture is the reason why the Cu-Zr-Mg-Y alloy has higher tensile strength in the rolling direction. The main phases of the Cu-Zr-Mg-Y alloy consist of Cu<sub>5</sub>Zr and a small amount of Mg<sub>24</sub>Y<sub>5</sub>. The increment in precipitation strengthening is primarily attributed to the coherent Cu<sub>5</sub>Zr phase within the matrix.</p></div>","PeriodicalId":23559,"journal":{"name":"Vacuum","volume":null,"pages":null},"PeriodicalIF":3.8000,"publicationDate":"2024-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of Y on the microstructure and physical properties of Cu-Zr-Mg-Y alloys\",\"authors\":\"\",\"doi\":\"10.1016/j.vacuum.2024.113651\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>This work presents the development of two novel Cu-Zr-Mg(Y) alloys. The alloys were prepared using vacuum melting and show good conductivity and mechanical properties after solution treatment+60 % cold rolling + aging at 450 °C for 60 min.</p><p>The measurement results reveal that the Cu-Zr-Mg alloy has a microhardness of 165 ± 5 HV, an electrical conductivity of 68.5 ± 0.2 % IACS and a tensile strength of 483 ± 15 MPa while the Cu-Zr-Mg-Y alloy has a microhardness of 172 ± 6 HV, an electrical conductivity of 67.9 ± 0.2 % IACS and a tensile strength of 503 ± 12 MPa.</p><p>The addition of Y promotes the recovery and recrystallization of the alloys and causes the refinement of the grain size. The appearance of copper texture is the reason why the Cu-Zr-Mg-Y alloy has higher tensile strength in the rolling direction. The main phases of the Cu-Zr-Mg-Y alloy consist of Cu<sub>5</sub>Zr and a small amount of Mg<sub>24</sub>Y<sub>5</sub>. The increment in precipitation strengthening is primarily attributed to the coherent Cu<sub>5</sub>Zr phase within the matrix.</p></div>\",\"PeriodicalId\":23559,\"journal\":{\"name\":\"Vacuum\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":3.8000,\"publicationDate\":\"2024-09-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Vacuum\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0042207X24006973\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Vacuum","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0042207X24006973","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Effect of Y on the microstructure and physical properties of Cu-Zr-Mg-Y alloys
This work presents the development of two novel Cu-Zr-Mg(Y) alloys. The alloys were prepared using vacuum melting and show good conductivity and mechanical properties after solution treatment+60 % cold rolling + aging at 450 °C for 60 min.
The measurement results reveal that the Cu-Zr-Mg alloy has a microhardness of 165 ± 5 HV, an electrical conductivity of 68.5 ± 0.2 % IACS and a tensile strength of 483 ± 15 MPa while the Cu-Zr-Mg-Y alloy has a microhardness of 172 ± 6 HV, an electrical conductivity of 67.9 ± 0.2 % IACS and a tensile strength of 503 ± 12 MPa.
The addition of Y promotes the recovery and recrystallization of the alloys and causes the refinement of the grain size. The appearance of copper texture is the reason why the Cu-Zr-Mg-Y alloy has higher tensile strength in the rolling direction. The main phases of the Cu-Zr-Mg-Y alloy consist of Cu5Zr and a small amount of Mg24Y5. The increment in precipitation strengthening is primarily attributed to the coherent Cu5Zr phase within the matrix.
期刊介绍：
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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