{"title":"使用不同固化剂制备的环氧树脂/多层石墨烯复合材料的导热性能","authors":"Miyuki Harada, Masafumi Horimoto, Tomoki Tsukuda","doi":"10.1016/j.tca.2024.179866","DOIUrl":null,"url":null,"abstract":"<div><p>Epoxy/multilayer graphene (ML-graphene) composites were prepared using different curing agents to control the graphene dispersion by changing the curing reactivity. With increasing initial reactivity, the aggregation size of the ML-graphene decreased and their thermal conductivity increased. In particular, the thermal conductivity of the composite prepared with <em>p</em>-phenylenediamine showed a maximum value of 1.46 W/(m·K) at 25 wt% ML-graphene loading because of the highest initial curing reactivity. The application of a magnetic field led to graphene alignment along the applied field, resulting in two times higher thermal conductivity than that of the corresponding system without magnetic field. The relationship between the interfacial affinity for epoxy/graphene and thermal conductivity was also investigated. As a result, resulting in a biphenyl epoxy composite showed higher thermal conductivity (6.17 W/(m·K)) than that of the bisphenol-A epoxy composite. This is derived that the π-conjugated and planar structure of biphenyl epoxy can easily interact with the surface of graphene.</p></div>","PeriodicalId":23058,"journal":{"name":"Thermochimica Acta","volume":null,"pages":null},"PeriodicalIF":3.1000,"publicationDate":"2024-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal conductivity of epoxy/multilayered graphene composites prepared with different curing agents\",\"authors\":\"Miyuki Harada, Masafumi Horimoto, Tomoki Tsukuda\",\"doi\":\"10.1016/j.tca.2024.179866\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Epoxy/multilayer graphene (ML-graphene) composites were prepared using different curing agents to control the graphene dispersion by changing the curing reactivity. With increasing initial reactivity, the aggregation size of the ML-graphene decreased and their thermal conductivity increased. In particular, the thermal conductivity of the composite prepared with <em>p</em>-phenylenediamine showed a maximum value of 1.46 W/(m·K) at 25 wt% ML-graphene loading because of the highest initial curing reactivity. The application of a magnetic field led to graphene alignment along the applied field, resulting in two times higher thermal conductivity than that of the corresponding system without magnetic field. The relationship between the interfacial affinity for epoxy/graphene and thermal conductivity was also investigated. As a result, resulting in a biphenyl epoxy composite showed higher thermal conductivity (6.17 W/(m·K)) than that of the bisphenol-A epoxy composite. This is derived that the π-conjugated and planar structure of biphenyl epoxy can easily interact with the surface of graphene.</p></div>\",\"PeriodicalId\":23058,\"journal\":{\"name\":\"Thermochimica Acta\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":3.1000,\"publicationDate\":\"2024-09-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Thermochimica Acta\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0040603124002053\",\"RegionNum\":2,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"CHEMISTRY, ANALYTICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thermochimica Acta","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0040603124002053","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, ANALYTICAL","Score":null,"Total":0}
Thermal conductivity of epoxy/multilayered graphene composites prepared with different curing agents
Epoxy/multilayer graphene (ML-graphene) composites were prepared using different curing agents to control the graphene dispersion by changing the curing reactivity. With increasing initial reactivity, the aggregation size of the ML-graphene decreased and their thermal conductivity increased. In particular, the thermal conductivity of the composite prepared with p-phenylenediamine showed a maximum value of 1.46 W/(m·K) at 25 wt% ML-graphene loading because of the highest initial curing reactivity. The application of a magnetic field led to graphene alignment along the applied field, resulting in two times higher thermal conductivity than that of the corresponding system without magnetic field. The relationship between the interfacial affinity for epoxy/graphene and thermal conductivity was also investigated. As a result, resulting in a biphenyl epoxy composite showed higher thermal conductivity (6.17 W/(m·K)) than that of the bisphenol-A epoxy composite. This is derived that the π-conjugated and planar structure of biphenyl epoxy can easily interact with the surface of graphene.
期刊介绍:
Thermochimica Acta publishes original research contributions covering all aspects of thermoanalytical and calorimetric methods and their application to experimental chemistry, physics, biology and engineering. The journal aims to span the whole range from fundamental research to practical application.
The journal focuses on the research that advances physical and analytical science of thermal phenomena. Therefore, the manuscripts are expected to provide important insights into the thermal phenomena studied or to propose significant improvements of analytical or computational techniques employed in thermal studies. Manuscripts that report the results of routine thermal measurements are not suitable for publication in Thermochimica Acta.
The journal particularly welcomes papers from newly emerging areas as well as from the traditional strength areas:
- New and improved instrumentation and methods
- Thermal properties and behavior of materials
- Kinetics of thermally stimulated processes