Amares SINGH , Hui Leng CHOO , Wei Hong TAN , Rajkumar DURAIRAJ
{"title":"添加 Mo 和 ZrO2 纳米粒子对 Sn58Bi/Cu 焊点界面性能和剪切强度的影响","authors":"Amares SINGH , Hui Leng CHOO , Wei Hong TAN , Rajkumar DURAIRAJ","doi":"10.1016/S1003-6326(24)66564-7","DOIUrl":null,"url":null,"abstract":"<div><p>The influence of Mo and ZrO<sub>2</sub> nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated. The interfacial microstructures of Sn58Bi/Cu, Sn58Bi + Mo/Cu and Sn58Bi + ZrO<sub>2</sub>/Cu solder joints were analysed using a scanning electron microscope (SEM) coupled with energy dispersive X-ray (EDX) and the X-ray diffraction (XRD). Intermetallic compounds (IMCs) of MoSn<sub>2</sub> are detected in the Sn58Bi + Mo/Cu solder joint, while SnZr, Zr<sub>5</sub>Sn<sub>3</sub>, ZrCu and ZrSn<sub>2</sub> are detected in Sn58Bi + ZrO<sub>2</sub>/Cu solder joint. IMC layers for both composite solders comprise of Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn. The SEM images of these layers were used to measure the IMC layer’s thickness. The average IMC layer’s thickness is 1.4431 µm for Sn58Bi + Mo/Cu and 0.9112 µm for Sn58Bi + ZrO<sub>2</sub>/Cu solder joints. Shear strength of the solder joints was investigated via the single shear lap test method. The average maximum load and shear stress of the Sn58Bi + Mo/Cu and Sn58Bi + ZrO<sub>2</sub>/Cu solder joints are increased by 33% and 69%, respectively, as compared to those of the Sn58Bi/Cu solder joint. By comparing both composite solder joints, the latter prevails better as adding smaller sized ZrO<sub>2</sub> nanoparticles improves the interfacial properties granting a stronger solder joint.</p></div>","PeriodicalId":23191,"journal":{"name":"Transactions of Nonferrous Metals Society of China","volume":"34 8","pages":"Pages 2619-2628"},"PeriodicalIF":4.7000,"publicationDate":"2024-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S1003632624665647/pdf?md5=c738c87478eb014cb6d13629711e35c5&pid=1-s2.0-S1003632624665647-main.pdf","citationCount":"0","resultStr":"{\"title\":\"Effect of Mo and ZrO2 nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint\",\"authors\":\"Amares SINGH , Hui Leng CHOO , Wei Hong TAN , Rajkumar DURAIRAJ\",\"doi\":\"10.1016/S1003-6326(24)66564-7\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The influence of Mo and ZrO<sub>2</sub> nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated. The interfacial microstructures of Sn58Bi/Cu, Sn58Bi + Mo/Cu and Sn58Bi + ZrO<sub>2</sub>/Cu solder joints were analysed using a scanning electron microscope (SEM) coupled with energy dispersive X-ray (EDX) and the X-ray diffraction (XRD). Intermetallic compounds (IMCs) of MoSn<sub>2</sub> are detected in the Sn58Bi + Mo/Cu solder joint, while SnZr, Zr<sub>5</sub>Sn<sub>3</sub>, ZrCu and ZrSn<sub>2</sub> are detected in Sn58Bi + ZrO<sub>2</sub>/Cu solder joint. IMC layers for both composite solders comprise of Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn. The SEM images of these layers were used to measure the IMC layer’s thickness. The average IMC layer’s thickness is 1.4431 µm for Sn58Bi + Mo/Cu and 0.9112 µm for Sn58Bi + ZrO<sub>2</sub>/Cu solder joints. Shear strength of the solder joints was investigated via the single shear lap test method. The average maximum load and shear stress of the Sn58Bi + Mo/Cu and Sn58Bi + ZrO<sub>2</sub>/Cu solder joints are increased by 33% and 69%, respectively, as compared to those of the Sn58Bi/Cu solder joint. By comparing both composite solder joints, the latter prevails better as adding smaller sized ZrO<sub>2</sub> nanoparticles improves the interfacial properties granting a stronger solder joint.</p></div>\",\"PeriodicalId\":23191,\"journal\":{\"name\":\"Transactions of Nonferrous Metals Society of China\",\"volume\":\"34 8\",\"pages\":\"Pages 2619-2628\"},\"PeriodicalIF\":4.7000,\"publicationDate\":\"2024-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.sciencedirect.com/science/article/pii/S1003632624665647/pdf?md5=c738c87478eb014cb6d13629711e35c5&pid=1-s2.0-S1003632624665647-main.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Transactions of Nonferrous Metals Society of China\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1003632624665647\",\"RegionNum\":1,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"METALLURGY & METALLURGICAL ENGINEERING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of Nonferrous Metals Society of China","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1003632624665647","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"METALLURGY & METALLURGICAL ENGINEERING","Score":null,"Total":0}
Effect of Mo and ZrO2 nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint
The influence of Mo and ZrO2 nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated. The interfacial microstructures of Sn58Bi/Cu, Sn58Bi + Mo/Cu and Sn58Bi + ZrO2/Cu solder joints were analysed using a scanning electron microscope (SEM) coupled with energy dispersive X-ray (EDX) and the X-ray diffraction (XRD). Intermetallic compounds (IMCs) of MoSn2 are detected in the Sn58Bi + Mo/Cu solder joint, while SnZr, Zr5Sn3, ZrCu and ZrSn2 are detected in Sn58Bi + ZrO2/Cu solder joint. IMC layers for both composite solders comprise of Cu6Sn5 and Cu3Sn. The SEM images of these layers were used to measure the IMC layer’s thickness. The average IMC layer’s thickness is 1.4431 µm for Sn58Bi + Mo/Cu and 0.9112 µm for Sn58Bi + ZrO2/Cu solder joints. Shear strength of the solder joints was investigated via the single shear lap test method. The average maximum load and shear stress of the Sn58Bi + Mo/Cu and Sn58Bi + ZrO2/Cu solder joints are increased by 33% and 69%, respectively, as compared to those of the Sn58Bi/Cu solder joint. By comparing both composite solder joints, the latter prevails better as adding smaller sized ZrO2 nanoparticles improves the interfacial properties granting a stronger solder joint.
期刊介绍：
The Transactions of Nonferrous Metals Society of China (Trans. Nonferrous Met. Soc. China), founded in 1991 and sponsored by The Nonferrous Metals Society of China, is published monthly now and mainly contains reports of original research which reflect the new progresses in the field of nonferrous metals science and technology, including mineral processing, extraction metallurgy, metallic materials and heat treatments, metal working, physical metallurgy, powder metallurgy, with the emphasis on fundamental science. It is the unique preeminent publication in English for scientists, engineers, under/post-graduates on the field of nonferrous metals industry. This journal is covered by many famous abstract/index systems and databases such as SCI Expanded, Ei Compendex Plus, INSPEC, CA, METADEX, AJ and JICST.
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