Cu(In,Ga)Se2 柔性光伏器件中应变与电荷之间的相互作用

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Ha Kyung Park, Kanghoon Yim, Jiyoon Lee, Yunae Cho, Inyoung Jeong, Donghyeop Shin, Jihye Gwak, Aron Walsh, Kihwan Kim, William Jo
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引用次数: 0

摘要

柔性轻质 Cu(In,Ga)Se2 (CIGS) 薄膜太阳能电池具有广泛的应用前景,但人们对应力引起的变化了解有限。本研究使用经过不同碱处理的柔性 CIGS 薄膜太阳能电池研究了机械应力下的电荷载流子产生和捕获行为。CIGS 表面的表面电流因凸面弯曲而减少,这种情况在加入碱金属后发生得更少。在凸弯曲环境中,载流子缺陷的形成能量增加,这说明了表面电流的衰减。此外,碱金属相关缺陷的形成能量低于固有受体,减轻了机械应力条件下的电流衰减。缺陷能级的改变归因于弯曲状态下晶体结构的变形。这项研究为减轻应变引起的电荷降解提供了见解,从而提高了柔性 CIGS 光伏设备的性能和稳健性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Interplay between strain and charge in Cu(In,Ga)Se2 flexible photovoltaics

Interplay between strain and charge in Cu(In,Ga)Se2 flexible photovoltaics

Interplay between strain and charge in Cu(In,Ga)Se2 flexible photovoltaics
Flexible and lightweight Cu(In,Ga)Se2 (CIGS) thin-film solar cells are promising for versatile applications, but there is limited understanding of stress-induced changes. In this study, the charge carrier generation and trapping behavior under mechanical stress was investigated using flexible CIGS thin-film solar cells with various alkali treatments. Surface current at the CIGS surface decreased by convex bending, which occurs less with the incorporation of alkali metals. The formation energy of the carrier generating defects increased in convex bending environments clarifying the degradation of the surface current. Moreover, alkali-related defects had lower formation energy than the intrinsic acceptors, mitigating current degradation in mechanical stress condition. The altered defect energy levels were attributed to the deformation of the crystal structure under bending states. This study provides insights into the mitigating of strain-induced charge degradation for enhancing the performance and robustness of flexible CIGS photovoltaic devices.
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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