{"title":"表面处理前后金属化 Al2O3 和 Al2O3/Cu 焊接接头的微观结构特征","authors":"","doi":"10.1016/j.matchar.2024.114376","DOIUrl":null,"url":null,"abstract":"<div><p>Joining Al<sub>2</sub>O<sub>3</sub> ceramics to Cu heat pipes should be conducted at low temperatures since Cu heat pipes may fail at temperatures higher than 320 °C. Due to the poor wettability of low-temperature solder on Al<sub>2</sub>O<sub>3</sub> ceramics, it is essential to metallize Al<sub>2</sub>O<sub>3</sub> ceramics before joining Al<sub>2</sub>O<sub>3</sub> to Cu with a low-temperature solder. Surface metallization of Al<sub>2</sub>O<sub>3</sub> has been conducted using Ag-Cu-Ti active metal filler at 900 °C. Microanalysis indicates that an interfacial reaction occurs between the active metal filler and the Al<sub>2</sub>O<sub>3</sub>, leading to the formation of a Cu<sub>3</sub>Ti<sub>3</sub>O reaction layer. The metal layer on the surface of Al<sub>2</sub>O<sub>3</sub> is primarily composed of Ag (s, s) (solid solution), Cu (s, s) and Ti<sub>2</sub>Cu. The polishing treatment of the surface metal layer in metallized Al<sub>2</sub>O<sub>3</sub> results in a reduction of the oxide content and contaminants, which subsequently allows joining at low temperature. Low-temperature joining of metallized Al<sub>2</sub>O<sub>3</sub> to Cu has been carried out using Sn-Ag-Cu solder at 280 °C. The joining area of the joint includes a Cu<sub>3</sub>Ti<sub>3</sub>O reaction layer, a metal layer and a solder layer. The solder layer mainly consists of Sn (s, s), Ag<sub>3</sub>Sn and Cu<sub>6</sub>Sn<sub>5</sub>. The Al<sub>2</sub>O<sub>3</sub>/Cu joint fractures in the solder layer after the shearing test, indicating that the strength of the solder is relatively low. However, the interfacial bonding between the metallized Al<sub>2</sub>O<sub>3</sub>, solder layer and Cu base material is satisfactory.</p></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":null,"pages":null},"PeriodicalIF":4.8000,"publicationDate":"2024-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Microstructural characterizations of metallized Al2O3 before/after surface treatment and Al2O3/Cu soldered joint\",\"authors\":\"\",\"doi\":\"10.1016/j.matchar.2024.114376\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Joining Al<sub>2</sub>O<sub>3</sub> ceramics to Cu heat pipes should be conducted at low temperatures since Cu heat pipes may fail at temperatures higher than 320 °C. Due to the poor wettability of low-temperature solder on Al<sub>2</sub>O<sub>3</sub> ceramics, it is essential to metallize Al<sub>2</sub>O<sub>3</sub> ceramics before joining Al<sub>2</sub>O<sub>3</sub> to Cu with a low-temperature solder. Surface metallization of Al<sub>2</sub>O<sub>3</sub> has been conducted using Ag-Cu-Ti active metal filler at 900 °C. Microanalysis indicates that an interfacial reaction occurs between the active metal filler and the Al<sub>2</sub>O<sub>3</sub>, leading to the formation of a Cu<sub>3</sub>Ti<sub>3</sub>O reaction layer. The metal layer on the surface of Al<sub>2</sub>O<sub>3</sub> is primarily composed of Ag (s, s) (solid solution), Cu (s, s) and Ti<sub>2</sub>Cu. The polishing treatment of the surface metal layer in metallized Al<sub>2</sub>O<sub>3</sub> results in a reduction of the oxide content and contaminants, which subsequently allows joining at low temperature. Low-temperature joining of metallized Al<sub>2</sub>O<sub>3</sub> to Cu has been carried out using Sn-Ag-Cu solder at 280 °C. The joining area of the joint includes a Cu<sub>3</sub>Ti<sub>3</sub>O reaction layer, a metal layer and a solder layer. The solder layer mainly consists of Sn (s, s), Ag<sub>3</sub>Sn and Cu<sub>6</sub>Sn<sub>5</sub>. The Al<sub>2</sub>O<sub>3</sub>/Cu joint fractures in the solder layer after the shearing test, indicating that the strength of the solder is relatively low. However, the interfacial bonding between the metallized Al<sub>2</sub>O<sub>3</sub>, solder layer and Cu base material is satisfactory.</p></div>\",\"PeriodicalId\":18727,\"journal\":{\"name\":\"Materials Characterization\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.8000,\"publicationDate\":\"2024-09-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Characterization\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1044580324007575\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CHARACTERIZATION & TESTING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Characterization","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1044580324007575","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
Microstructural characterizations of metallized Al2O3 before/after surface treatment and Al2O3/Cu soldered joint
Joining Al2O3 ceramics to Cu heat pipes should be conducted at low temperatures since Cu heat pipes may fail at temperatures higher than 320 °C. Due to the poor wettability of low-temperature solder on Al2O3 ceramics, it is essential to metallize Al2O3 ceramics before joining Al2O3 to Cu with a low-temperature solder. Surface metallization of Al2O3 has been conducted using Ag-Cu-Ti active metal filler at 900 °C. Microanalysis indicates that an interfacial reaction occurs between the active metal filler and the Al2O3, leading to the formation of a Cu3Ti3O reaction layer. The metal layer on the surface of Al2O3 is primarily composed of Ag (s, s) (solid solution), Cu (s, s) and Ti2Cu. The polishing treatment of the surface metal layer in metallized Al2O3 results in a reduction of the oxide content and contaminants, which subsequently allows joining at low temperature. Low-temperature joining of metallized Al2O3 to Cu has been carried out using Sn-Ag-Cu solder at 280 °C. The joining area of the joint includes a Cu3Ti3O reaction layer, a metal layer and a solder layer. The solder layer mainly consists of Sn (s, s), Ag3Sn and Cu6Sn5. The Al2O3/Cu joint fractures in the solder layer after the shearing test, indicating that the strength of the solder is relatively low. However, the interfacial bonding between the metallized Al2O3, solder layer and Cu base material is satisfactory.
期刊介绍:
Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials.
The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal.
The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include:
Metals & Alloys
Ceramics
Nanomaterials
Biomedical materials
Optical materials
Composites
Natural Materials.