具有石墨烯沟道的 Z 型栅隧道场效应晶体管:对其模拟和线性性能的广泛研究

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Gunti Sneha , Sidhartha Dash , Guru Prasad Mishra
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引用次数: 0

摘要

这项研究分析了石墨烯沟道 Z 形栅极隧道场效应晶体管(ZTFET)的模拟和线性性能。这项研究旨在引入具有二维蜂窝结构的石墨烯,预计它将成为下一代半导体器件的有力挑战者。与传统硅沟道相比,石墨烯沟道 ZTFET 的导通电流增加了 3 倍,表明栅极电容和跨导有了显著改善。这种改进进一步提高了线性度和模拟/射频性能。我们深入研究了各种线性度和射频 (RF) 性能指标,包括 gmn、VIP2、VIP3、IIP3、1-dB 压缩点、GBWP、TFP、统一增益截止频率和最大振荡频率。新型 GC-ZTFET 的结果与传统 ZTFET 的结果进行了比较,以确定其优越性。就线性度、射频性能和载流能力而言,GC-ZTFET 优于其他器件结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Z-shaped gate tunnel FET with graphene channel: An extensive investigation of its analog and linearity performance

This work analyzes a graphene channel Z-shaped gate tunnel FET's (ZTFET) analog, and linearity performance. This research aims to introduce graphene with a two-dimensional honeycomb structure that is anticipated to be a strong challenger for the upcoming generation of semiconductor devices. The ZTFET with graphene channel provides a 3-decade increase in ON current, indicating a notable improvement in gate capacitance and transconductance compared to the conventional silicon channel. This improvement further leads to better linearity and analog/RF performance. We delved into various linearity and Radio Frequency (RF) figure-of-merits, including gmn, VIP2, VIP3, IIP3, 1‐dB compression point, GBWP, TFP, unity gain cut‐off frequency, and maximum oscillation frequency. The results of the new GC-ZTFET are compared with those of the traditional ZTFET to establish its superiority. The GC-ZTFET outshines other device structures when speaking of linearity, RF performance, and current-carrying capability.

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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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