Y. K. Pratheesha Mol, S. Vinu, S. Keerthi Gopakumar, S. Sindhusha, R. Sheela Christy, G. Vinitha
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引用次数: 0
摘要
通过缓慢蒸发法生成了马来酸氢镁六水合物单晶。通过单晶 X 射线衍射,确定了马来酸氢镁六水合物的晶体结构。它属于单斜晶系,空间群为 P21/c,晶格参数为 A = 10.207(5) Å,B = 11.829(5) Å,C = 6.745(3) Å,体积 V = 789.499 Å3。傅立叶变换红外光谱用于分析晶体的官能团。热重分析和差热分析用于研究马来酸氢镁六水合物单晶体的热稳定性和熔点。紫外-可见透射光谱的范围为 200-1100 纳米。HMHM 单晶体的带隙(Eg)是通过线性分量外推 4.9 eV 计算得出的。维氏硬度实验用于检测晶体的机械稳定性。生长出来的材料属于软质材料,"n "值为 2.7。超共轭相互作用是用自然键轨道(NBO)方法来解释的。利用 HOMO-LUMO 图确定了分子的化学势、电负性和化学硬度。
Organometallic hexa-aqua magnesium hydrogen maleate third-order nonlinear optical crystal for NLO and optoelectronic device applications
Hexa-aqua magnesium hydrogen maleate single crystal was generated by slow evaporation method. By using single-crystal X-ray diffraction, the crystal structure of hexa-aqua magnesium hydrogen maleate has been identified. It is a member of the monoclinic system with space group P21/c and the lattice parameter as A = 10.207(5) Å, B = 11.829(5) Å, C = 6.745(3) Å, and volume V = 789.499 Å3. FTIR spectroscopy was used to analyze the crystal’s functional groups. Thermogravimetric and differential thermal analyses have been used to examine the thermal stability and melting point of the hexa-aqua magnesium hydrogen maleate single crystal. UV–vis transmittance spectrum was identified in the range of 200–1100 nm. The band gap of an HMHM single crystal (Eg) has been calculated using extrapolation of the linear component with 4.9 eV. Vickers microhardness experiments were used to examine the crystal’s mechanical stability. The grown material belongs to soft category with ‘n’ value of 2.7. The hyperconjugative interaction was explained using the natural bond orbital (NBO) approach. The HOMO–LUMO plot was used to determine the molecule’s chemical potential, electronegativity, and chemical hardness.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.